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SU0-211 exam Dumps Source : Huawei Cert Datacom Associate-Network(R) Technology and Device

Test Code : SU0-211
Test cognomen : Huawei Cert Datacom Associate-Network(R) Technology and Device
Vendor cognomen : Huawei
: 865 true Questions

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Huawei Huawei Cert Datacom Associate-Network(R)

We did it once again: Hill+Knowlton Canada is a honorable area to Work™ for 12th yr running | killexams.com true Questions and Pass4sure dumps

TORONTO, April 26, 2018 /CNW/ - The surveys are in and the submissions were graded. With handiest six different companies in Canada which hold been named one of the vital country's ultimate workplaces for the twelfth consecutive yr, Hill+Knowlton options Canada (H+k) is supercilious to live among them. in keeping with remarks from tens of heaps of personnel throughout Canada, the annual record appears these days in a Globe and Mail particular country wide file.  

"every year, they are trying to finish extra for their employees and we're thrilled that they've helped us earn a further yr on the celebrated top-rated offices checklist," says Goldy Hyder, president and CEO of H+k. "We live awake of that an organization cannot create its personal tradition; its individuals create it and live it. Their job is effortlessly to deliver an atmosphere that fosters it."

Hill+Knowlton Canada is additionally a supercilious recipient of the 2018 first rate vicinity to travail Certification application. Now in its third yr, the Certification an enhancement to the most useful offices application and requires companies earn a selected hold faith Index rating plenary through the submission procedure.

"We're working hard at H+okay to build the kind of region of travail where plenary and sundry matters. where plenary of us attain new heights. the region scope and inclusion are cornerstones. the region ethics and integrity are every minute thing. Working inside a tradition of innovation where they seize dangers, comprise exchange and evolve — plenary to live inescapable their people thrive," adds Hyder. "beyond challenging work, they offer a plenary suite of first-price merits and incentives. even if it live their peer-driven subsidy application, mighty health subsidy, committed pro bono days, or presents of time that comprise additional-long weekends and a birthday vacation day, H+Kers were the driving drive behind a lifestyle that embraces work-existence balance."

Jose Tolovi Neto, the managing accomplice of extraordinary area to Work®Canada, concurs: "In an industry it's perpetually evolving, communications organizations require discipline and consistency to linger grotesque workplaces for personnel. Being able to celebrate its 12th year as a member of the top-quality offices™ in Canada is a tremendous accomplishment for Hill+Knowlton. It continues to deliver excellent employee experiences and create a honorable company tradition." 

most reliable places of travail Award criteriaThe competitors for "top-rated workplaces in Canada" is in keeping with two standards: two-thirds of the plenary rating comes from an in-depth survey achieved by a minimal variety of personnel, together with open-ended comments about the corporation; the closing one-third of the score comes from a evaluate of the organization's subculture, including an assessment of HR policies, methods and advantages. This offers a rigorous illustration of the firm from an worker standpoint, and an measure portrait of the office culture. The process is an unbiased analysis conducted by passage of the super region to travail Institute.

outstanding region to Work®notable region to Work® (outstanding region to Work® Institute Canada) is the global authority on excessive-have confidence, excessive-performance office cultures. we're a research and consulting company whose mission is to build a more robust society by means of helping corporations seriously change their offices. through proprietary assessment equipment, advisory capabilities and organization branding courses, including region of travail certification and most effective workplaces lists, extraordinary area to Work® offers the benchmarks, framework and abilities vital to create, sustain and admire astounding workplace cultures. In Canada, tremendous region to Work® produces the annual one hundred optimum places of travail listing, released in a countrywide characteristic within the Globe and Mail. this is Part of the realm's largest annual region of travail analyze, which culminates in a series of country wide lists in pretty much 50 international locations, including the gawk at's flagship record of one hundred most suitable corporations published annually in Fortune magazine. Globally, this survey represents the voices of eleven million employees, including about 300,000 from Canada on my own. or not it's what makes this anatomize so credible: the basic determinant utilized in deciding on winners is an worker survey. there may live only one solution to regain on this checklist—and that's in case your employees achieve you there. comply with superb region to Work® on-line at www.greatplacetowork.ca and on Twitter at @GPTW_Canada.

Hill+Knowlton StrategiesWith nine workplaces throughout the nation, Hill+Knowlton StrategiesCanada is a leader in each public members of the family and public affairs. Headquartered in Toronto, the company is the No. 1-rated strategic communications firm within the nation. Its consultants concentrate on company communications, advertising and marketing communications, public affairs, theme engagement, disaster, energy, know-how, fitness care, content advertising and marketing, research and size, social and digital communications, fiscal communications and transactions. The handiest communications firm to hold earned the Canada Order of Excellence for quality from Excellence Canada, it has been identified as one of the crucial choicest workplaces in Canada for 12 consecutive years. Its dad or mum enterprise, Hill+Knowlton strategies Inc., has 86 workplaces in additional than 47 nations in addition to an in depth associate community; and it's a member of WPP (NASDAQ: WPPGY), one of the world's largest communications functions corporations.

source Hill & Knowlton Canada


old Vs. New programs | killexams.com true Questions and Pass4sure dumps

over the years, the semiconductor industry has witnessed a parade of packaging improvements, equivalent to system-in-equipment, semiconductor embedded in substrate, and fan-out wafer-stage packaging.

Two entertaining packaging innovations are actually getting used in the system of miniaturizing microchips and electronics. One is a new thought that combines two tried-and-genuine technologies. The different is a decades-historical approach that is getting used in new methods.

keeping grime, humidity, air, even atmospheric pressure away from electronics is what hermetic packaging and sealing approaches hold performed very nearly in view that the age of dinosaurs–for more than seventy five years, predating the transistor and the integrated circuit. The method of airtight packaging and sealing puts an impenetrable layer round electronics that maintains air (fuel) and water vapor far from electronic parts, making them air- and water-tight, consequently holding them from corrosion and different environmental risks.

New traits in airtight packaging and sealing are actually making sooner, lighter, and smaller electronics viable.

Any expertise that helps cram in more components devoid of sacrificing capabilities is additionally welcome to handset producers. a different expertise entrance within the quest for better miniaturization is the substrate-like printed circuit board, or SLP. It represents a Go between a resilient substrate and a rigid board.

The SLP shows up simplest in smartphones now, but it surely may well live used in IoT contraptions and finally AI applications, augmented and virtual reality devices, and automobiles. some of the immense advantages is the pliability of no longer having to develop a altenative from a PCB or substrates.

Substrate-like PCBsSubstrate-like PCBs were employed in assembling the iPhone 8 fashions and the iPhone X, in accordance with Yole Développement, which describes the technology as “a clash of two worlds,” PCBs and substrates. SLP could prove to live an alternative altenative to modified semi-additive processes, besides referred to as mSAP, according to Yole.

“advanced substrates hold to acknowledge demands on each the scaling and practical roadmaps,” writes Emilie Jolivet, a technology and market analyst at Yole. “The transition from the subtractive to the mSAP system and from PCB to substrate-like PCB is beneath manner in excessive-end smartphones, pushed via Apple and its iPhone eight/iPhone X. other excessive-conclusion smartphone suppliers, corresponding to Samsung and Huawei, are expected to associate in the near future.”

SLP will should seize custody of different technologies, namely paraphernalia substrate vs. no substrate with fan-out structures, together with via-silicon via packaging vs. TSV-less packaging.

Yole forecasts the SLP market will raise from $1.9 billion in 2016 to $2.24 billion by 2023.

“The 28 selected PCB/substrate manufacturers are plenary believed to hold mSAP know-how, and some of them can manufacture SLP,” observed Yole’s Vivienne Hsu. “pushed by using high-end smartphone demand, positive players look to hold extravagant capital bills. meanwhile, some immense gamers parade constant revenue in their PCB/substrate enterprise.”

Seung Wook Yoon, director of group expertise method for the JCET community, the parent company of STATS ChipPAC, describes SLP as “a video game changer for the trade.”

SLP may imply that outsourced semiconductor assembly and gawk at various (OSAT) valued clientele received’t must choose between PCBs or substrates for their items. He expects Samsung to solemnize Apple’s example.

Fan-out wafer-level packaging is for high-end software processors going into top rate items, the flagship smartphone fashions for handset vendors, in line with Yoon. SLP is reputed for the motherboard of telephones, reducing the house vital for such assemblies. Ball grid arrays or flip-chip packages are greater usually used for quality-pitch slots in a mobilephone, he noted. Wafer-level packages offer even finer pitches.

He likened SLP to chip-on-board packaging.

Printed circuit boards are progressing to the factor the region they could present integration moreover interconnection, in accordance with Yole. Yoon echoed that remark. “here is in particular for the combination,” he says.

while the primary noteworthy implementation of SLP is in cellphones, such superior semiconductor packaging may additionally locate functions in 5G instant communications, synthetic intelligence, augmented and virtual reality, automotive electronics, and cyber web of things contraptions.

When it involves superior packaging, gadget-in-package expertise and modules are other leading space-saving innovations, Yoon notes. “The can charge could live better,” he says.

He sees SLP probably being used in IoT instruments, apart from cellphones. cutting back the cost and the dimension linger the major issues.

airtight packaging and sealingHermetic packaging and sealing, in the meantime, is already ubiquitous. it is utilized in automotive electronics, aerospace and aviation techniques, optical communication components and gadget for fiber-optic data telecommunications, sensor manufacturing, and different industrial applications. The airbag igniter in automobiles is one instance of airtight packaging.

“It’s challenging to pinpoint just one overarching style,” said Robert Hettler, head of R&D for optoelectronics at SCHOTT electronic Packaging, a unit of SCHOTT North the united states and Germany’s SCHOTT AG. “despite the fact, there are a brace of developments within quite a few markets and functions.”

larger precision is one among them. the realm’s ever-becoming hunger for facts and sooner transmission fees has increased claim for higher-performance chips.

“faster chips want legit, high-performance hermetically sealed packaging to achieve ever-faster information charges. The so-called ‘closing mile’ to the customer, which covers fiber transmission lines to the domestic, can live unachievable without a new generation of high-efficiency, excessive-precision airtight applications,” says Hettler. “SCHOTT recently added 50G hermetic transistor contour can packages, that could pave the passage for lots-essential bandwidth raises on datacom networks. 50G transistor contour (TO) technology will besides allow sooner data transmission to instant telephone towers, offering a technology that will live used to deploy 5G cellular networks, an growth that allows you to deliver speeds exponentially faster than existing 4G infrastructure.”

He additionally cites the scope in substances used for hermetic packaging and sealing.

“On a cloth degree, there was an expand sought after for using non-magnetic materials, fancy titanium and niobium, that are unique materials for a brace of high-reliability applications. Glass-titanium compounds are above plenary smartly-acceptable for use within the areas of aviation, aerospace, oil and gas, and medical technology — if non-magnetic yet light-weight housings are crucial. however, nickel-copper alloys are flawless for chemically aggressive environments as a result of its acid and alkali resistance,” Hettler says. “In clinical electronics, the style toward implantable gadgets is besides leading to an expand sought after for using biocompatible materials fancy titanium and tantalum. perquisite here, the development of totally respectable, yet more and more miniaturized airtight packaging is of the essence. The development of glass-to-aluminum sealing know-how now allows the manufacture of hermetic feedthroughs made with aluminum. This cloth is extremely exciting for functions by which there is a exigency for light-weight substances or the region aluminum is customarily used for the casing, equivalent to supercapacitors, electric powered double-layer capacitors, and lithium-ion batteries. Newly developed aluminum lid programs with airtight glass-to-aluminum sealed feedthroughs assist higher or longer-lasting performance of capacitors and batteries.”

Miniaturization in contemporary-day electronics is a precedence, and hermetic packaging and sealing can address that need.

“Miniaturization in airtight glass-to-metal and ceramic-to-steel sealed applications is a primary factor of headquarters of attention,” he says. “increasing application demands, especially for smaller and smaller form-factor components, hold made miniaturization a key theme in product innovation. a very crucial illustration can live present in the fiber-optic area as TO applications for prime-pace records transmission hold been gotten smaller for brand new, chopping-side purposes: in the construction and transition from TO56 to TO38 packages, the footprint shrank by passage of basically 33%. besides miniaturization of airtight glass-to-steel and ceramic-to-steel packaging, full-ceramic multilayer housings and substrates adventure multiplied hobby. Multilayer ceramics guide the becoming vogue towards miniaturization, cater for more advantageous complexity requirements but besides present mind-blowing thermal administration houses: The multilayer design allows the construction of miniature 3D interconnect solutions, paving the style for prime-density input/output capability in small-kind-ingredient airtight applications for each feedthroughs and multilayer ceramic circuit board substrates. superior thermal conductivity of excessive-temperature co-fired ceramics and temperature resistance past 300 degrees Celsius (572 levels F) develop HTCC substrates an measure fitting for prime-energy functions.”

How is hermetic packaging and sealing being used nowadays?

“the most universal uses for airtight seals fluctuate extensively across many different areas,” Hettler says. “one of the most exceptional uses encompass fiber optics and high-velocity records transfer, automobile safeguard systems and other add-ons, and pressure sensor feedthroughs and packaging purposes. in the protection, aviation, and aerospace industries, airtight housings and connectors are often used to offer protection to reliability-critical manage and instrumentation electronics.”

Microelectromechanical device gadgets are one enviornment the region airtight packaging and sealing are required, no longer only a know-how that’s respectable to hold in positive purposes.

“MEMS are sensitive and frangible accessories that are sometimes placed in harsh environments, or in locations wherein substitute is expensive and inconvenient. airtight packaging and sealing provides legitimate insurance draw that can aid prolongate the lifetime of these contraptions,” he says. “for instance, SCHOTT HermeS glass wafer substrates with hermetically sealed stalwart steel through-glass vias enable miniaturized yet incredibly reliable and effective 3D wafer-degree chip-scale packaging. The excellent-pitched vias permit the bona fide conduction of electrical indicators and energy into and out of the MEMS device. using glass wafers in hermetic packaging has multiplied impulsively in fresh years. The core motives are the sophisticated properties glass offers as a packaging cloth in particular, including its biocompatibility, the excellent transparency to radio frequencies and the transparency to seen gentle, which allows a wide array of optical purposes. TGV know-how permit long-time period, official and intensely rugged packaging of commercial sensors, RF MEMS, and medical electronics.”

ConclusionAchieving ever-advancing miniaturization in microchips and electronics can summon for numerous new packaging technologies. Then again, tried-and-genuine approaches, equivalent to airtight packaging and sealing, can additionally fill the bill.


Molex Receives 2008 most usurp Technical aid Award from Huawei applied sciences | killexams.com true Questions and Pass4sure dumps

Huawei cites Molex's stunning consumer relationship management in aid of Huawei's R&D team as key to win

LISLE, sick. June 24, 2009 - Molex included (NASDAQ: MOLX and MOLXA) become awarded the 2008 "ideal Technical assist" award by using Huawei technologies Co. Ltd., a pacesetter in providing next era telecommunications network solutions for operators plenary over. The award recognizes Molex's continued information to and aid of Huawei's R&D crew in offering timely and professional technical counsel and powerful revenue and consumer carrier for Huawei's new product design.

"We're honored to hold bought the "most suitable Technical aid" award from Huawei," stated candid Tan, VP of APS earnings and marketing, Molex incorporated. "Molex labored closely with the Huawei R&D team to develop certain prompt technical back and quick hardship decision."

In recognizing Molex, Huawei executives renowned that the enterprise's marvelous customer relationship administration has resulted in a extremely extravagant stage of hold faith in Molex's technical capabilities to supply main datacom options. said Zheng Yi, vice director of CEG, Huawei: "The Molex group even geared up an audit commute for the Huawei team to

Molex's minute Rock connector factory to assist us improved deem the business's manufacturing techniques."Molex is the handiest connector supplier to win this award from Huawei. Most these days, Huawei chose the Molex ImpactTM 6-pair measure backplane and daughtercard connectors.

For more tips, gratify debate with www.molex.com.

About Molex integrated

Molex included is a 70-yr-old global brand of digital, electrical and fiber optic interconnection methods. based in Lisle, Illinois, u . s . a ., the company operates 45 manufacturing areas in 17 countries. The Molex web page is www.molex.com.

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Old Vs. New Packages | killexams.com true questions and Pass4sure dumps

Over the years, the semiconductor industry has witnessed a parade of packaging innovations, such as system-in-package, semiconductor embedded in substrate, and fan-out wafer-level packaging.

Two exciting packaging innovations are now being used in the process of miniaturizing microchips and electronics. One is a new concept that combines two tried-and-true technologies. The other is a decades-old technique that is being used in new ways.

Keeping dirt, humidity, air, even atmospheric pressure away from electronics is what hermetic packaging and sealing processes hold done almost since the age of dinosaurs–for more than 75 years, predating the transistor and the integrated circuit. The process of hermetic packaging and sealing puts an impenetrable layer around electronics that keeps air (gas) and water vapor away from electronic parts, making them air- and water-tight, thus protecting them from corrosion and other environmental hazards.

New developments in hermetic packaging and sealing are now making faster, lighter, and smaller electronics possible.

Any technology that helps cram in more components without sacrificing functions is besides welcome to handset manufacturers. Another technology front in the quest for greater miniaturization is the substrate-like printed circuit board, or SLP. It represents a cross between a resilient substrate and a rigid board.

The SLP shows up only in smartphones now, but it may live used in IoT devices and eventually AI applications, augmented and virtual reality devices, and automobiles. One of the immense advantages is the flexibility of not having to choose between a PCB or substrates.

Substrate-like PCBsSubstrate-like PCBs were employed in assembling the iPhone 8 models and the iPhone X, according to Yole Développement, which describes the technology as “a clash of two worlds,” PCBs and substrates. SLP could prove to live an alternative to modified semi-additive processes, besides known as mSAP, according to Yole.

“Advanced substrates must acknowledge demands on both the scaling and functional roadmaps,” writes Emilie Jolivet, a technology and market analyst at Yole. “The transition from the subtractive to the mSAP process and from PCB to substrate-like PCB is under passage in high-end smartphones, driven by Apple and its iPhone 8/iPhone X. Other high-end smartphone suppliers, such as Samsung and Huawei, are expected to associate in the near future.”

SLP will hold to contend with other technologies, namely package substrate vs. no substrate with fan-out platforms, along with through-silicon via packaging vs. TSV-less packaging.

Yole forecasts the SLP market will expand from $1.9 billion in 2016 to $2.24 billion by 2023.

“The 28 selected PCB/substrate manufacturers are plenary believed to hold mSAP technology, and some of them can manufacture SLP,” said Yole’s Vivienne Hsu. “Driven by high-end smartphone demand, inescapable players materialize to hold high capital expenditures. Meanwhile, some large players exhibit even revenue in their PCB/substrate business.”

Seung Wook Yoon, director of group technology strategy for the JCET Group, the parent company of STATS ChipPAC, describes SLP as “a game changer for the industry.”

SLP could carry weight that outsourced semiconductor assembly and test (OSAT) customers won’t hold to choose between PCBs or substrates for their products. He expects Samsung to succeed Apple’s example.

Fan-out wafer-level packaging is for high-end application processors going into premium products, the flagship smartphone models for handset vendors, according to Yoon. SLP is meant for the motherboard of phones, reducing the space needed for such assemblies. Ball grid arrays or flip-chip packages are more typically used for fine-pitch slots in a phone, he noted. Wafer-level packages offer even finer pitches.

He likened SLP to chip-on-board packaging.

Printed circuit boards are progressing to the point where they can offer integration in addition to interconnection, according to Yole. Yoon echoed that observation. “This is mainly for the integration,” he says.

While the first noteworthy implementation of SLP is in mobile phones, such advanced semiconductor packaging could besides find applications in 5G wireless communications, ersatz intelligence, augmented and virtual reality, automotive electronics, and Internet of Things devices.

When it comes to advanced packaging, system-in-package technology and modules are other leading space-saving innovations, Yoon notes. “The cost may live higher,” he says.

He sees SLP possibly being used in IoT devices, in addition to mobile phones. Reducing the cost and the size remain the prime considerations.

Hermetic packaging and sealingHermetic packaging and sealing, meanwhile, is already ubiquitous. It is used in automotive electronics, aerospace and aviation systems, optical communication components and system for fiber-optic data telecommunications, sensor manufacturing, and other industrial applications. The airbag igniter in automobiles is one sample of hermetic packaging.

“It’s hard to pinpoint just one overarching trend,” said Robert Hettler, head of R&D for optoelectronics at SCHOTT Electronic Packaging, a unit of SCHOTT North America and Germany’s SCHOTT AG. “However, there are a number of trends within various markets and applications.”

Higher precision is one of them. The world’s ever-growing hunger for data and faster transmission rates has increased claim for higher-performance chips.

“Faster chips exigency reliable, high-performance hermetically sealed packaging to achieve ever-faster data rates. The so-called ‘last mile’ to the customer, which covers fiber transmission lines to the home, would live unachievable without a new generation of high-performance, high-precision hermetic packages,” says Hettler. “SCHOTT recently introduced 50G hermetic transistor contour can packages, which can pave the passage for much-needed bandwidth increases on datacom networks. 50G transistor contour (TO) technology will besides enable faster data transmission to wireless cell towers, providing a technology that will live used to deploy 5G cellular networks, an improvement that will deliver speeds exponentially faster than current 4G infrastructure.”

He besides cites the variety in materials used for hermetic packaging and sealing.

“On a material level, there has been an expand in claim for the use of non-magnetic materials, fancy titanium and niobium, which are exciting materials for a number of high-reliability applications. Glass-titanium compounds are especially well-suited for use in the areas of aviation, aerospace, oil and gas, and medical technology — if non-magnetic yet lightweight housings are needed. Alternatively, nickel-copper alloys are ideally suited for chemically aggressive environments due to its acid and alkali resistance,” Hettler says. “In medical electronics, the trend toward implantable devices is besides leading to an expand in claim for the use of biocompatible materials fancy titanium and tantalum. Here, the development of highly reliable, yet more and more miniaturized hermetic packaging is of the essence. The development of glass-to-aluminum sealing technology now enables the manufacture of hermetic feedthroughs made with aluminum. This material is highly exciting for applications in which there is a exigency for lightweight materials or where aluminum is typically used for the casing, such as supercapacitors, electric double-layer capacitors, and lithium-ion batteries. Newly developed aluminum lid systems with hermetic glass-to-aluminum sealed feedthroughs back higher or longer-lasting performance of capacitors and batteries.”

Miniaturization in modern-day electronics is a priority, and hermetic packaging and sealing can address that need.

“Miniaturization in hermetic glass-to-metal and ceramic-to-metal sealed packages is a main point of focus,” he says. “Increasing application demands, particularly for smaller and smaller form-factor components, hold made miniaturization a key topic in product innovation. A particularly apposite sample can live create in the fiber-optic arena as TO packages for high-speed data transmission hold been reduced in size for new, cutting-edge applications: in the development and transition from TO56 to TO38 packages, the footprint shrank by nearly 33%. Besides miniaturization of hermetic glass-to-metal and ceramic-to-metal packaging, full-ceramic multilayer housings and substrates sustain increased interest. Multilayer ceramics back the growing trend towards miniaturization, cater for enhanced complexity requirements but besides offer excellent thermal management properties: The multilayer design enables the production of miniature 3D interconnect solutions, paving the passage for high-density input/output capability in small-form-factor hermetic packages for both feedthroughs and multilayer ceramic circuit board substrates. Superior thermal conductivity of high-temperature co-fired ceramics and temperature resistance beyond 300 degrees Celsius (572 degrees F) develop HTCC substrates a flawless fitting for high-power applications.”

How is hermetic packaging and sealing being used today?

“The most approved uses for hermetic seals vary widely across many different areas,” Hettler says. “Some of the most notable uses comprise fiber optics and high-speed data transfer, automotive safety systems and other components, and pressure sensor feedthroughs and packaging applications. In the defense, aviation, and aerospace industries, hermetic housings and connectors are often used to protect reliability-critical control and instrumentation electronics.”

Microelectromechanical system devices are one area where hermetic packaging and sealing are required, not just a technology that’s honorable to hold in inescapable applications.

“MEMS are sensitive and frangible components that are often placed in harsh environments, or in places in which replacement is expensive and inconvenient. Hermetic packaging and sealing provides reliable protection that can serve prolongate the lifetime of these devices,” he says. “For example, SCHOTT HermeS glass wafer substrates with hermetically sealed solid metal through-glass vias enable miniaturized yet highly reliable and robust 3D wafer-level chip-scale packaging. The fine-pitched vias allow the reliable conduction of electrical signals and power into and out of the MEMS device. The use of glass wafers in hermetic packaging has increased rapidly in recent years. The core reasons are the superior properties glass offers as a packaging material in particular, including its biocompatibility, the excellent transparency to radio frequencies and the transparency to visible light, which enables a wide scope of optical applications. TGV technology enable long-term, reliable and extremely rugged packaging of industrial sensors, RF MEMS, and medical electronics.”

ConclusionAchieving ever-advancing miniaturization in microchips and electronics can summon for a variety of new packaging technologies. Then again, tried-and-true approaches, such as hermetic packaging and sealing, can besides fill the bill.


Global LAN/WAN Test paraphernalia Industry | killexams.com true questions and Pass4sure dumps

NEW YORK, Feb. 4, 2019 /PRNewswire/ -- This report analyzes the worldwide markets for LAN/WAN Test paraphernalia in US$ Thousand by the following Product Segments: Protocol Analyzers, Performance Analyzers & Stress Testers, and Conformance & Interoperability Test Systems.

Read the plenary report: https://www.reportlinker.com/p04484181

The report provides part comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and repose of World.

Annual estimates and forecasts are provided for the term 2015 through 2022. Also, a six-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs.

The report profiles 52 companies including many key and niche players such as:- Anritsu Corporation- AOIP- Averna- EXFO Inc.- Fortive Corporation- Greenlee Textron, Inc.

Read the plenary report: https://www.reportlinker.com/p04484181

LAN/WAN TEST paraphernalia MCP-1MARKET ANALYSIS, TRENDS, AND FORECASTS, JANUARY 2CONTENTS

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting LimitationsDisclaimersData Interpretation & Reporting LevelQuantitative Techniques & AnalyticsProduct Definitions and Scope of StudyProtocol AnalyzersPerformance Analyzers & Stress TestersConformance & Interoperability Test Systems

II. EXECUTIVE SUMMARY

1. INDUSTRY OVERVIEWLAN/WAN Test paraphernalia Market: An Introductory PreludeNorthbound Trajectory in the Global ICT Sector Creates Conducive EnvironmentCSPs' Thrust Towards QoS & QoE Propagates Large-Scale OpportunitiesDeveloped Nations: Key Revenue ContributorsTable 1: Developed Regions Account for over 70% partake of the World LAN/WAN Test paraphernalia Market - Percentage Breakdown of Revenues for Developed and Developing Regions (2018E & 2022P) (includes corresponding Graph/Chart)Market Senses Huge Opportunities in Developing NationsTable 2: Global LAN/WAN Test paraphernalia Market - Geographic Regions Ranked by % CAGR for 2015-2022: Asia-Pacific (excluding Japan), repose of World, Canada, Europe, US, and Japan (includes corresponding Graph/Chart)Assessing the impact of Recent Economic Upheavals on LAN/WAN Test paraphernalia MarketStable Economic Scenario to Augment Market claim in the Near- TermTable 3: World true GDP Growth Rates in % (2016-2018P): Breakdown by Country/Region (includes corresponding Graph/Chart)Competitive LandscapeLeading Players in the Global LAN/WAN Test paraphernalia MarketVendors Prioritize M&A Route to Enhance trade OperationsSelect M&A Deals in the Global LAN/WAN Test paraphernalia Market (2014-2018)Pricing Scenario

2. KEY PRODUCT & APPLICATION MARKET TRENDSPerformance Analyzers & Stress Testers: The Key Product SegmentTable 4: World LAN/WAN Performance Analyzers & Stress Testers Market by End-User Segment (2017): Percentage Breakdown of Revenues for Communication Service Providers, Network paraphernalia Manufacturers, and Private Enterprises (includes corresponding Graph/Chart)Protocol Analyzers Continue to Generate RevenuesNoteworthy Trends in Protocol Analyzers SegmentBluetooth Protocol Analyzers accumulate SeamPCIe Protocol Analyzers Assume ImportanceDOCSIS Protocol Analyzers develop a CutTable 5: World LAN/WAN Protocol Analyzers Market by End-User Segment (2017): Percentage Breakdown of Revenues for Communication Service Providers, Network paraphernalia Manufacturers, and Private Enterprises (includes corresponding Graph/Chart)Conformance & Interoperability Test Systems: critical for Network EquipmentKey factors answerable for Interoperability Issues: A SnapshotTable 6: World LAN/WAN Conformance & Interoperability Test Systems Market by End-User Segment (2017): Percentage Breakdown of Revenues for Communication Service Providers, Network paraphernalia Manufacturers and Private Enterprises (includes corresponding Graph/Chart)Test paraphernalia Gain Precedence in Network R&D, I&M & ProductionModular Test paraphernalia develop Their WayCloud-based SaaS Solutions seek Role in LAN/WAN Testing SpaceProgression in Network Technologies: A Challenge to Test paraphernalia Vendors

3. KEY END-USE MARKET TRENDSEscalating Telecom & Datacom Traffic Volumes & Subsequently Rising exigency to Augment Network Efficiency Builds stalwart trade CaseTable 7: Global IP Traffic Volume in Exabytes (2014, 2016, 2018E & 2020P) (includes corresponding Graph/Chart)Table 8: Global IP Traffic Scenario by Region/Country (2017): Percentage Breakdown of Internet Data Consumption for North America, Japan, Europe, Asia-Pacific, Latin America, and repose of World (includes corresponding Graph/Chart)Table 9: Global IP Traffic Scenario by Consumer Segment (2017): Percentage Breakdown of Internet Consumption for general and trade Consumers (includes corresponding Graph/Chart)Key Factors Influencing Telecom & Datacom Traffic GrowthSharp expand in the Number of Internet SubscribersTable 10: Global Internet Usage by Geographic Region (2017): Percentage Breakdown of Number of Internet Users for Africa, Asia-Pacific, Europe, Latin America, Middle East, and North America (includes corresponding Graph/Chart)Table 11: Global Internet Usage by Geographic Region (2017): Penetration Rate of Internet (as a % of Total Population) for Africa, Asia-Pacific, Europe, Latin America, Middle East, and North America (includes corresponding Graph/Chart)Faster Broadband SpeedsSurging Investments on Advanced Telecom Infrastructure Extends Parallel OpportunitiesNetwork Test paraphernalia Assume critical significance in Wireless NetworksWi-Fi Roll Outs Bodes Well for Network Test paraphernalia Market GrowthContinued Evolution in IEEE 802.11 Standards Generates Parallel OpportunitiesWider Uptake of Smartphones Instigates Expansion in Wireless NetworksTable 12: Global Portable Devices Market by Device sort (2017 & 2020P): Percentage Breakdown of Unit Sales for Laptops, M2M Devices, Non-Smartphones, Smartphones, Tablets, and Others (includes corresponding Graph/Chart)Upcoming 5G Technology to Drive New Line of OpportunitiesExpanding Role of Fiber Optic Networks offer OpportunitiesKey Trends Driving Growth in Fiber Optic Network DeploymentsSoaring Investments on EPON & GPON TechnologiesTests for Passive Optical Networks (PONs): A SnapshotProliferation of FTTx NetworksISPs achieve Focus on Test paraphernalia Amid Soaring claim for Gigabit Access ServicesNEMs ante on Test paraphernalia in paraphernalia Design & DevelopmentTest paraphernalia for Seamless Deployment & Operation of Enterprise IT NetworksBusiness Continuity & Security Needs Propagate claim for Enterprise-Grade Test EquipmentExpanding Image of Enterprise Mobility Creates trade CaseLAN/WAN Test paraphernalia profit from Sustained claim for VoIPEmerging IoT to Widen the Scope & Span of Network Test EquipmentM2M Communication Networks Set to Instigate New Opportunities

4. PRODUCT OVERVIEWLocal area Network (LAN)DefinitionFactors Differentiating Various LANsTopologyBus TopologyRing TopologyStar TopologyProtocolsMediaWide area Network (WAN)LAN/WAN Test EquipmentProtocol AnalyzersPerformance Analyzers & Stress TestersConformance & Interoperability Test SystemsOther Testing Tools for LAN/WANCable TesterBit-Error Rate Tester (BERT)Personal Network AnalyzersPhysical Layer Tools for Testing LANCapacitance MeterNoise MeterPower MeterOhmmeterTime Domain ReflectometerHigh Frequency Signal GeneratorLine MapperTerminatorsMatching TerminatorShorting TerminatorEnhancements in LAN Testing CapabilitiesWireless LAN - An OverviewComparing 802.11ad, 802.11af and 802.11ah ProtocolsGrowth Drivers for WLAN MarketPros and Cons

5. PRODUCT INTRODUCTIONS/INNOVATIONSTektronix Rolls Out 59 GHz DPO7OE2 single Mode Optical ProbeIDEAL Networks Releases Software Updates for SignalTEK CT and SignalTEK NT TestersSpirent Communications Develops World's Highest Density 400/ 200/100/50GbE Test SystemTeledyne LeCroy Expands Link Layer Compliance Tests PortfolioVeEX Introduces RXT-6200 Universal 100G Test Module for RXT- 1200 PlatformVIAVI Solutions Upgrades Cable Signal Meters with Trilithic' Leak Detection TechnologyEXFO Rolls Out SkyRAN Proactive Test & Monitoring Solution for RF Interference & Fronthaul NetworksAnritsu Unveils Radio Communication Test Station MT8000A PlatformNational Instruments Develops LabView NXG 1.0Netscout Systems Unveils LinkRunner™ G2 Android-based Smart Network TesterVIAVI Solutions Rolls Out FiberChek SidewinderViavi Solutions Introduces Xgig 4K16 Protocol Analyzer/Jammer for PCI Express 4.0 TechnologySaelig Unveils USB-Powered Bluetooth Protocol AnalyzerKeysight Technologies Launches Industry's First 5G Protocol Test SolutionTeledyne LeCroy Launches LinkExpert Software Interface for its PCIe Protocol AnalyzersTeledyne LeCroy Introduces Eclipse M32 UniPro/ UFS Protocol Analyzer/ExerciserSpirent Communications Rolls Out World's First 200G Ethernet Test SystemFuturePlus Systems Introduces industry's First HBRDisplayPort Protocol Analysis ToolEXFO Releases FTBx-88400NGE Power Blazer 400G Testing SolutionAnritsu Develops ME7800L Conformance Test SystemSpirent Unveils First Automotive Ethernet Protocol Conformance & Performance Test System with 1000BASE-T1 Physical Layer StandardIntrospect Technology Enhances SV3C Personal SerDes Tester with DSLineeye Releases LE-3500R & LE-2500R Multi-Protocol AnalyzersAnritsu Rolls Out CPRI RF Module for Network Master Pro™ MT1000A TesterIxia Rolls Out TrafficREWIND™Teledyne LeCroy Unveils T416 PCIe AnalyzerTeledyne LeCroy Rolls Out Sodera LE AnalyzerSpirent Introduces Spirent Vertex Channel Emulator for Wireless RF TestingSpirent Unveils Spirent TestCenter WLAN Test PlatformSpirent Expands Elevate™ Test Framework & Prolab™ Test Suite for EVS Codec TestingSpirent Launches Spirent TemevaSpirent Introduces Spirent Landslide™ C100-M2 Test PlatformSpirent Launches CyberFlood™ Security & Performance Testing SolutionAnritsu Introduces OTDR Module for Network Master™ Pro MT1000A TesterGL Communications Unveils PacketExpert 10G Ethernet/IP TesterGreenlee® Introduces AirScout™ Wi-Fi Readiness Test SolutionIDEAL Networks Launches LanTEK® II Cable CertifierFrontline Rolls Out ComProbe Sodera Wideband Bluetooth Protocol AnalyzerSpirent Rolls Out 50GbE Boost Ethernet Test SolutionTeledyne LeCroy Introduces Voyager M310C USB Protocol Analyzer and Exerciser SystemSpirent Unveils DX2-100GbE QSFP28 and CFP4 8-Port ModulesIxia unveils 25GbE Validation SolutionAnritsu Receives LTE 3CA PTCRB Certification for ME7873LA LTE- Advanced RF Conformance Test SystemAnritsu Unveils Remote Spectrum Monitor

6. RECENT INDUSTRY ACTIVITYoneM2M Selects Spirent's Compliance Testing ToolsTeledyne LeCroy Receives Bluetooth SIG's Validation for Harmony LE TesterViavi Solutions Acquires Cobham's AvComm and Wireless T&M BusinessesNI to Collaborate with Samsung to Develop 5G Test UEs for 5G NRRiverbed Launches Riverbed mount Channel partner ProgramEXFO Partners with KontronEXFO Acquires Majority Stake in AstelliaSpirent Communications Announces Spirent Pace Global partner ProgramEXFO Teams Up with ADVAEXFO Collaborates with China Mobile for IoT Network TestingHuawei Endorses Anritsu's MT8870A Test Platform for RF Calibration & Validation TestsSamsung Selects Anritsu's Signal Analyzer MS2850A for 5G System DevelopmentsNational Instruments Acquires AWRFluke Networks Snaps Up ClearSight NetworksKeysight Technologies Acquires IxiaEXFO Acquires Yenista OpticsAnritsu Inks Distribution Agreement with Comtec Cable AccessoriesIDEAL Networks Opens New Office in ShanghaiIDEAL Networks Launches New Office in MelbourneTeledyne Lecroy Acquires Quantum DataAnritsu Acquires Azimuth SystemsNoviFlow Teams Up with IxiaArrow Electronics Inks Distribution Agreement with IxiaIxia Joins New IP Agency (NIA)QualiTest Joins Ixia's Global Solution Provider ProgramTeledyne Technologies Acquires Frontline Test EquipmentSpirent Acquires Testing TechnologiesT-Mobile Netherlands Selects Anritsu's MasterClaw™ Service Assurance SystemChina Unicom Teams Up with Spirent to Test Virtualization MiddlewareVector Informatik Collaborates with IxiaSpirent Takes Over EpitiroSimplay™ Labs Receives Evaluation Approval for SL-8Miracast HDCP 2.2 Test instrument from DCPTeledyne LeCroy Extends Capabilities of PCI Protocol Analyzer Product FamilyIntel Selects Averna's DP-1000 DOCSIS Protocol AnalyzerFortinet Collaborates with Spirent to Validate FortiGate®- 3810D Firewall ApplianceSGS Deploys Spirent 8100 LTE Solution to Enhance critical Test CapabilitiesViavi Solutions Establishes Lumentum

7. FOCUS ON SELECT GLOBAL PLAYERSAnritsu Corporation (Japan)AOIP (France)Averna (Canada)EXFO, Inc. (Canada)Fortive Corporation (USA)Fluke Corporation (USA)Tektronix, Inc. (USA)Greenlee Textron, Inc. (USA)IDEAL INDUSTRIES, INC. (USA)Keysight Technologies, Inc. (USA)Ixia (USA)National Instruments Corporation (USA)NetScout Systems, Inc. (USA)Riverbed Technology, Inc. (USA)Rohde & Schwarz (Germany)Spirent Communications plc (UK)Teledyne LeCroy (USA)VeEX, Inc. (USA)Digital Lightwave (USA)Viavi Solutions, Inc. (USA)Wilcom Inc. (USA)

8. GLOBAL MARKET PERSPECTIVETable 13: World Recent Past, Current & Future Analysis for LAN/WAN Test paraphernalia by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and repose of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 14: World Historic Analysis for LAN/WAN Test paraphernalia by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and repose of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 15: World 14-Year Perspective for LAN/WAN Test paraphernalia by Region/Country - Percentage Breakdown of Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and repose of World Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)Analytics by Product SegmentTable 16: World Recent Past, Current & Future Analysis for Protocol Analyzers (PA) by Region/ Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and repose of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 17: World Historic Analysis for Protocol Analyzers (PA) by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and repose of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 18: World 14-Year Perspective for Protocol Analyzers (PA) by Region/Country - Percentage Breakdown of Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and repose of World Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)Table 19: World Recent Past, Current & Future Analysis for Performance Analyzers & Stress Testers (PA&ST) by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and repose of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 20: World Historic Analysis for Performance Analyzers & Stress Testers (PA&ST) by Region/ Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and repose of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 21: World 14-Year Perspective for Performance Analyzers & Stress Testers (PA&ST) by Region/ Country - Percentage Breakdown of Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and repose of World Markets for the Years 2009, 2018 & 2022 (includes corresponding Graph/Chart)Table 22: World Recent Past, Current & Future Analysis for Conformance and Interoperability Test Systems (C&ITS) by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and repose of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 23: World Historic Analysis for Conformance and Interoperability Test Systems (C&ITS) by Region/ Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and repose of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2(includes corresponding Graph/Chart)Table 24: World 14-Year Perspective for Conformance and Interoperability Test Systems (C&ITS) by Region/ Country - Percentage Breakdown of Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and repose of World Markets for the Years 2009, 2018 & 2022 (includes corresponding Graph/Chart)

III. MARKET

1. THE UNITED STATESA.Market AnalysisThe Prime Market for LAN/WAN Test EquipmentTable 25: US Accounts for Over 2/5th partake of the World LAN/WAN Test paraphernalia Market - Percentage Breakdown of Revenues for US and repose of World (2018E & 2022P) (includes corresponding Graph/Chart)Performance Analyzers & Stress Testers - Order of the DayProtocol Analyzers - A Key Product CategoryMarket Witnesses Shift from Conventional Protocol AnalyzersConformance & Interoperability Test Systems - Witnessing Buoyant GrowthCompetitive ScenarioImpact of 2007-2009 Economic Recession in RetrospectProduct LaunchesStrategic Corporate DevelopmentsSelect Key PlayersB.Market AnalyticsTable 26: US Recent Past, Current & Future Analysis for LAN/WAN Test paraphernalia by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 27: US Historic Analysis for LAN/WAN Test paraphernalia by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 28: US 14-Year Perspective for LAN/WAN Test paraphernalia by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)

2. CANADAA.Market AnalysisRobust Investments on Wi-Fi & Mobile Network Deployments Generate OpportunitiesProduct LaunchesCorporate DevelopmentSelect Key PlayersB.Market AnalyticsTable 29: Canadian Recent Past, Current & Future Analysis for LAN/WAN Test paraphernalia by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 30: Canadian Historic Analysis for LAN/WAN Test paraphernalia by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 31: Canadian 14-Year Perspective for LAN/WAN Test paraphernalia by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)

3. JAPANA.Market AnalysisProduct LaunchesKey PlayerB.Market AnalyticsTable 32: Japanese Recent Past, Current & Future Analysis for LAN/WAN Test paraphernalia by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 33: Japanese Historic Analysis for LAN/WAN Test paraphernalia by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 34: Japanese 14-Year Perspective for LAN/WAN Test paraphernalia by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)

4. EUROPEA.Market AnalysisA develope MarketIncreasing Deployment of Wireless Networks Bolster Market GrowthContinued Investments on LTE Networks Drives Wireless Test paraphernalia MarketStrategic Corporate DevelopmentsProduct LaunchSelect Key PlayersB.Market AnalyticsTable 35: European Recent Past, Current & Future Analysis for LAN/WAN Test paraphernalia by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 36: European Historic Analysis for LAN/WAN Test paraphernalia by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 37: European 14-Year Perspective for LAN/WAN Test paraphernalia by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)

5. ASIA-PACIFICA.Market AnalysisHigh-Potential Opportunities Prevail in the Asia-Pacific RegionAdvancements in Communication Infrastructure Drive DemandRapidly Growing Outdoor Wi-Fi Deployments Bode WellCompetition Set to IntensifyWireless Test paraphernalia Market in China: An OverviewGrowing Outdoor Wi-Fi Roll OutsWireless Test paraphernalia Market in IndiaOutdoor Wi-Fi Gathers SteamProduct LaunchStrategic Corporate DevelopmentsB.Market AnalyticsTable 38: Asia-Pacific Recent Past, Current & Future Analysis for LAN/WAN Test paraphernalia by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2(includes corresponding Graph/Chart)Table 39: Asia-Pacific Historic Analysis for LAN/WAN Test paraphernalia by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 40: Asia-Pacific 14-Year Perspective for LAN/WAN Test paraphernalia by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)

6. repose OF WORLDMarket AnalysisTable 41: repose of World Recent Past, Current & Future Analysis for LAN/WAN Test paraphernalia by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2(includes corresponding Graph/Chart)Table 42: repose of World Historic Analysis for LAN/WAN Test paraphernalia by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 43: repose of World 14-Year Perspective for LAN/WAN Test paraphernalia by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)

IV. COMPETITIVE LANDSCAPE

Total Companies Profiled: 52 (including Divisions/Subsidiaries - 60) The United States (30) Canada (6) Japan (3) Europe (11) - France (2) - Germany (2) - The United Kingdom (4) - repose of Europe (3) Asia-Pacific (Excluding Japan) (10)Read the plenary report: https://www.reportlinker.com/p04484181

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Molex Receives 2008 Best Technical back Award from Huawei Technologies | killexams.com true questions and Pass4sure dumps

Huawei cites Molex's outstanding customer relationship management in back of Huawei's R&D team as key to win

LISLE, Ill. June 24, 2009 - Molex Incorporated (NASDAQ: MOLX and MOLXA) was awarded the 2008 "Best Technical Support" award by Huawei Technologies Co. Ltd., a leader in providing next generation telecommunications network solutions for operators around the world. The award recognizes Molex's continued assistance to and back of Huawei's R&D team in providing timely and professional technical counsel and stalwart sales and customer service for Huawei's new product design.

"We're honored to hold received the "Best Technical Support" award from Huawei," said candid Tan, VP of APS sales and marketing, Molex Incorporated. "Molex worked closely with the Huawei R&D team to ensure prompt technical back and rapid issue resolution."

In recognizing Molex, Huawei executives renowned that the company's excellent customer relationship management has led to a very high plane of reliance in Molex's technical capabilities to provide leading datacom solutions. Said Zheng Yi, vice director of CEG, Huawei: "The Molex team even organized an audit trip for the Huawei team to

Molex's minute Rock connector factory to serve us better understand the company's manufacturing processes."Molex is the only connector supplier to win this award from Huawei. Most recently, Huawei chose the Molex ImpactTM 6-pair measure backplane and daughtercard connectors.

For more information, gratify visit www.molex.com.

About Molex Incorporated

Molex Incorporated is a 70-year-old global manufacturer of electronic, electrical and fiber optic interconnection systems. Based in Lisle, Illinois, USA, the company operates 45 manufacturing locations in 17 countries. The Molex website is www.molex.com.

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