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This information is for the 2018/19 session.
Dr Mylene Lagarde COW three.02
This route is purchasable on the MSc in international fitness coverage, MSc in fitness policy, Planning and Financing, MSc in overseas fitness coverage and MSc in odd health coverage (fitness Economics). This path is purchasable with consent as an outdoor preference to college students on different programmes where regulations permit.
Randomized trials believe lengthy been used within the clinical world to check the efficacy of scientific treatments. these days, social scientists believe every started the exhaust of the very approach, the exhaust of random stint to designate substances or enforce a policy intervention in a different way to different groups, to be able to investigate the causal effects of the coverage of pastime. The popularity of randomized evaluations has grown primarily, however not completely, amongst researchers and policymakers in low- and middle-revenue settings.
Conducting a successful randomized contrast contains many inter-connected steps and an excellent knowing of a number of statistical ideas. Randomized opinions additionally constantly require to design and organise the facts collection of crucial and valuable advice, which involves a number of crucial steps to hold away from pitfalls. it is for this reason elementary to understand these distinct steps to design and implement randomised reviews effectively, or to be in a position to significantly analyse them.
This route proposes a fingers-on and intuitive approach to designing and conducting a randomised assessment. within the first half of the path, they will focus on causes for carrying out randomised opinions; the way to design the randomise experiment to be positive it solutions the query(s) of activity (including concerns of statistical dash and pattern size calculation); how to deal with threats to randomisation. in the second half of the route, they can talk about useful issues raised by means of simple statistics assortment, including how to greatest measure outcomes of hobby; the way to design decent apparatus and how to conduct and manipulate fieldwork.
Seminars should be designed to motivate college students to significantly interact with the themes and follow the technical lore taught. each seminar might be carefully aligned with the lecture content to supply college students the probability to observe the brand unique knowledge. Case experiences may be chosen from a variety of cultural backgrounds, to permit the presentation of a diverse sweep of settings and considerations.
15 hours of lectures and 15 hours of seminars in the LT.
A draft protocol. students might be requested to publish a brief 1,500 notice draft protocol by using week eight. whereas some facets of their toil can too nonetheless be toil in growth (e.g. the exhaust of bullet aspects), college students should be anticipated to write up the primary half of their protocol in a extra particular approach. The outlines will be graded and comments given to students. This allows college students to procure constructive event of writing at MSc plane at LSE, and they will too remember extra especially the expectations of the summative evaluation. students could be able to exhaust this comments in their writing of the summative work.
research concept (100%) within the LT.
The objective of the analysis protocol (four,000 phrases max) might be to devise the randomised evaluation of a specific health programme. college students may be requested to pick one programme from a proposed record. they will too be given the option to select their own intervention (pending agreement by their seminar chief).
Microsoft showed off the primary client home windows combined reality head-hooked up shows (HMDs) from partners such as Acer, Dell, HP, and Lenovo returned in October 2017 at an sustain in San Francisco. The devices launched alongside the home windows 10 plunge Creators update, with expenses genesis at $299. The HMDs got here with different designs, but equivalent specifications similar to a 1440X1440 resolution display, and framerates of 60fps for PCs with integrated snap shots and 90fps for programs with discrete snap shots.
while no longer plenty in the way of a refresh to many of these devices took place, Samsung launched its 2d-era HMD, the Odyssey+ in October 2018, with improvements to standards and the design of the machine. quickly, another unique headset could be on the way, as HP is additionally readying it next-generation HMD, as per the folks at RoadtoVR who got an unique preview of the unannounced windows blended reality headset, codenamed ‘Copper’.
The record states that HP is re-designing its HMD from the floor up, and from the appears of it, it does flaunt to be a significant replace. The apparatus now activities an Oculus Rift-like design with the top straps going throughout the sides and above the top, meeting at a round constitution at the returned. The device is additionally anticipated to involve a heathered fabric on the front where the cameras for tracking can be found. The headset is declared to be lighter, making it more restful to sequel on, and it will additionally characteristic better mechanicals to develop it more straightforward to sequel on and remove away.
As for specs, the subsequent-technology gadget will offer a 2160X2160 resolution monitor per eye, making it essentially the most pixel-dense disclose in a combined truth Headset yet. In assessment, Samsung’s unique Odyssey+ activities a 1440X1600 conclusion disclose per eye. obviously, the denser screen makes for crisp, lucid pictures, bringing a lot-crucial improvements to the event. The denser parade too helps mask the disclose door sequel (the impact caused by using the unlit spaces between any two pixels), negating the want for additional add-ons just like the diffuser on Samsung’s Odyssey+.
HP states that the advancements to the HMD came from its commercial enterprise valued clientele and that the consumers didn’t accept as lawful with the box of view a huge enviornment of difficulty as a distinguished deal because the conclusion and luxury. The enterprise is planning on bringing this headset to its device as a service for VR offering as allotment of the Z by HP brand.
while HP didn't disclose particulars about the launch date or pricing, the enterprise did validate that it will be selling the apparatus to each, firms and patrons. windows mixed reality has been receiving advancements in the latest verify builds for the next most vital windows 10 replace, which might well-nigh actually be referred to as the windows 10 April 2019 replace. The platform has additionally begun seeing extended relevance in gaming, so it might be unique to note how smartly ‘Copper’ may be obtained, and if the improvements inspire extra clients to correspond with it.
source: RoadtoVR by means of Thurrott
Autodesk, an award-successful American utility enterprise, has collaborated with HP and GE Additive to develop generative design utility apparatus that toil directly with 3D printers.
in response to Autodesk’s Netfabb and Fusion 360, the design-to-print workflow for additive manufacturing can be built-in in HP Multi Jet Fusion and GE Direct steel Laser Melting (DMLM) methods to enlarge quick prototyping for creation-equipped 3D printed components.
Robert Yancey, director of producing industry way at Autodesk, defined to Design information:
“To release the whole cost of HP MJF printers, you want a superb design, an excellent material, and a distinguished print procedure. Autodesk develops the design tools and know-how, HP develops the print manner, and HP with their cloth companions develops the materials. every aspects are required to achieve highest efficiency.”The HP Jet Fusion 3D 4210/4200 Printing solution. picture by way of HP.
A generative workflow
right through Formnext, HP introduced a partnership with Autodesk to enable generative design capabilities across the total HP Multi Jet Fusion portfolio. Following this collaboration, Christoph Schell, President of 3D Printing and Digital Manufacturing, HP Inc., pointed out:
“Many industries akin to automobile, which is going through its greatest transformation in additional than 100 years, want to unique technologies and strategic partners like HP to uphold them superior compete during this time of exchange.”
“we are working with innovators to trade the style they design and manufacture, unlocking unique purposes, extra manufacturing flexibility, and improved innovation, effectivity, and sustainability across their product construction lifecycle.”
similarly, Autodesk is working with GE Additive to streamline steel additive manufacturing. using GE Additive’s utility algorithms, interfaces, and specialized data fashions, this workflow will present predictive insights for can suffuse and timeline projections within the early levels of design.
“Working with Autodesk will provide an impressive design-to-print atmosphere for their clients, assisting lessen the boundaries of additive adoption while accelerating a consumer’s time to first decent half,” said Lars Bruns, govt utility chief at GE Additive.3D printed bike ingredients from HP. image by way of HP/ Motus.
implementing an conclusion-to-end workflow
As a mutual consumer of Autodesk and HP, Penumbra Engineering, a u.s.generative design company, recently used Autodesk’s design-to-print workflow to provide an ultrasonic sensing machine. This 3D printed half became designed to be light-weight and sturdy inside extravagant environments.
“The Penumbra case behold at uncovers the cost of HP working with Autodesk generative design know-how,” added Yancey.
“We’re aiding HP printers in Fusion 360 and Netfabb in order that HP multi-jet fusion consumers believe the design and print prep tools they need. We’re working with HP to provide guide for the brand unique steel printers.”A 3D printed handheld transducer created by Penumbra Engineering. image by way of Penumbra Engineering,
publish your nominations now for the 3D Printing industry Awards 2019.
also, for the newest 3D Printing industry updates subscribe to their publication, follow us on Twitter and like us on fb.
in search of a fresh genesis in the unique year? talk over with 3D Printing Jobs to commence your career in additive manufacturing.
Featured photo shows 3D printed parts from HP. photograph by means of HP.
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Business tidings of Saturday, 9 February 2019
National Academy of Engineering is among the highest professional distinctions accorded to an engine
The National Academy of Engineering (NAE) has elected 86 unique members and 18 odd members, announced NAE President C. D. (Dan) Mote, Jr., today.
This brings the total U.S. membership to 2,297 and the number of odd members to 272.
The election to the National Academy of Engineering is among the highest professional distinctions accorded to an engineer.
Academy membership honors those who believe made outstanding contributions to “engineering research, practice, or education, including, where appropriate, significant contributions to the engineering literature” and to “the pioneering of unique and developing fields of technology, making major advancements in traditional fields of engineering, or developing/implementing innovative approaches to engineering education.”
Individuals in the newly elected class will be formally inducted during a ceremony at the NAE’s annual meeting in Washington, D.C., on Oct. 6, 2019.
A list of the newly elected members and odd members follows, with their primary affiliations at the time of election and a brief statement of their principal engineering accomplishments.
Below is the list of unique members
Agonafer, Dereje, Jenkins Garrett Professor and director, mechanical and aerospace engineering department, University of Texas, Arlington. For contributions to computer-aided electro/thermo/mechanical design and modeling of electronic equipment.
Ahuja, Krishan K., Regents Professor, Daniel Guggenheim School of Aerospace Engineering, Georgia Tech, Atlanta. For the development of quieter aerosystems and contributions to aeroacoustics research, literature, and education.
Aizenberg, Joanna, Amy Smith Berylson Professor of Materials Science and professor of chemistry and chemical biology, School of Engineering, Harvard University, Cambridge, Mass. For contributions to understanding of biological systems and bioinspired materials design.
Antonsson, Erik K., president and chief executive officer, aiPod Inc., Pasadena, Calif. For leadership in the development of aerospace/defense systems, formal methods of engineering design, and lively learning in engineering education.
Axelrad, Penina, Joseph T. Negler Professor, Ann and H.J. Smead Aerospace Engineering Sciences, University of Colorado, Boulder. For application of multipath GPS signals to ameliorate satellite navigation and unique approaches to remote sensing.
Baker, Mary, chairman and president, ATA Engineering Inc., San Diego. For computer simulation methods for structural mechanics problems and engineering leadership.
Balta, Wayne S., vice president, corporate environmental affairs and product safety, IBM Corp., Armonk, N.Y. For advancing corporate environmental sustainability practices worldwide.
Barabino, Gilda A., Daniel and Frances Berg Professor and dean, Grove School of Engineering, City College of unique York, unique York City. For leadership in bioengineering research and inclusive models of bioengineering education and faculty mentoring.
Barrangou, Rodolphe, Todd R. Klaenhammer Distinguished Scholar in Probiotics Research, and professor, food, bioprocessing, and nutrition science, North Carolina condition University, Raleigh. For discovery of CRISPR-Cas genome editing and engineering microbes, plants, and animals for food and other applications.
Barros, Ana P., James L. Meriam Professor of Civil and Environmental Engineering, Duke University, Durham, N.C. For contributions to understanding and prediction of precipitation dynamics and flood hazards in mountainous terrains.
Benioff, Marc R., chairman and co-chief executive officer, Salesforce, San Francisco. For leadership in cloud computing and corporate philanthropy.
Bishop, David J., director, CELL-MET Engineering Research Center, and head, division of materials science and engineering, Boston University, Boston. For contributions and leadership in high-capacity optical switch technology.
Biswas, Pratim, Stanley and Lucy Lopata Professor and chair, department of energy, environmental, and chemical engineering, Washington University, St. Louis. For advancing the science of aerosol dynamics and particle removal technologies.
Braatz, Richard D., Edwin R. Gilliland Professor of Chemical Engineering, chemical engineering department, Massachusetts Institute of Technology, Cambridge. For contributions to diagnosis and control of large-scale and molecular processes for materials, microelectronics, and pharmaceuticals manufacturing.
Broadbelt, Linda J., Sarah Rebecca Roland Professor, department of chemical and biological engineering, Northwestern University, Evanston, Ill. For contributions to tangled kinetic modeling, particularly for understanding the pathways by which hydrocarbons and polymers undergo pyrolysis.
Chen, Wei, Wilson-Cook Professor in Engineering Design and professor of mechanical engineering, Northwestern University, Evanston, Ill. For contributions to design under suspicion in products and systems, and leadership in the engineering design community.
Clark, Douglas S., dean, College of Chemistry, and professor of chemical and biomolecular engineering, University of California, Berkeley. For advances in biocatalyst and bioreaction engineering for drug discovery, drug screening, and bioprocessing.
Conger IV, Harry M. “Red,” president and chief operating officer, Americas, Freeport-McMoRan Inc., Phoenix. For contributions to copper mine/plant design and leadership of Freeport to become the world’s top private copper producer.
Deisseroth, Karl, D.H. Chen Professor, bioengineering and psychiatry and behavioral sciences, Stanford University and Howard Hughes Medical Institute, Stanford, Calif. For molecular and optical tools for discovery and control of neuronal signals behind animal behavior in health and disease.
Deligianni, Hariklia, retired research scientist, IBM Corp., Tenafly, N.J. For electrochemical processes used by major microelectronic chip producers worldwide.
Eccles, Thomas J., rear admiral, U.S. Navy (retired), and chief executive officer, Trident Maritime Systems, Arlington, Va. For service in naval engineering and advances in submarine technology.
England, Paul, director, Microsoft Research, Redmond, Wash. For defining the hardware foundations of secure computing, Trusted Platform Module, and secure enclaves, and for conceiving the darknet.
Erdemir, Ali, Distinguished Fellow and program lead, materials for harsh conditions, applied materials division, Argonne National Laboratory, Argonne Ill. For contributions to the science and technology of friction, lubrication, and wear.
Fascetti, Robert J., retired vice president, global powertrain engineering, Ford Motor Co., Bloomfield Hills, Mich. For leadership in powertrain products with improved fuel economy, superior performance, and reduced greenhouse gas emissions.
Gallimore, Alec D., Robert J. Vlasic Dean of Engineering and professor, University of Michigan, Ann Arbor. For advanced spacecraft electric propulsion, especially Hall thruster technology.
Glotzer, Sharon C., Anthony C. Lembke Department Chair of Chemical Engineering and professor, University of Michigan, Ann Arbor. For development of computer-based design principles for assembly engineering and manufacturing of advanced materials and nanotechnology.
Grejner-Brzezinska, Dorota A., Lowber B. disorderly Endowed Professor and chair, civil, environmental, and geodetic engineering, Ohio condition University, Columbus. For contributions to geodetic science and satellite navigation, including integration with ersatz intelligence.
Halpern, Joseph Y., Joseph C. Ford Professor of Engineering, computer science department, Cornell University, Ithaca, N.Y. For methods of reasoning about knowledge, belief, and suspicion and their applications to distributed computing and multiagent systems.
Hassan, Yassin A., Sallie and Don Davis ’61 Professor in Engineering, departments of nuclear engineering and mechanical engineering, Texas A&M University, College Station. For experimentally validated thermal hydraulic analyses of multiphase flood fields for nuclear reactor operations.
Heritage, Jonathan P., professor emeritus, department of electrical and computer engineering, University of California, Davis. For contributions to optical pulse shaping and wavelength selective optical switches.
Hudson, Linda P., chairman and chief executive officer, The Cardea Group, Charlotte, N.C. For leadership in development and production of military systems, and for mentoring and developing future engineering leaders.
Ingebritsen, Steven E., research hydrologist, U.S. Geological Survey, U.S. Department of Interior, Menlo Park, Calif. For contributions to understanding the role of groundwater in geologic processes.
Jordan, William C., principal, Jordan Analytics LLC, Beverly Hills, Mich. For development of analytic methods to ameliorate manufacturing systems and for quantitative analysis of future mobility systems.
Katz, Joseph, William F. Ward Sr. Distinguished Professor, department of mechanical engineering, Johns Hopkins University, Baltimore. For development of optical methods in experimental fluid mechanics for turbomachinery, cavitation, turbulence, and environmental flows.
Khoshnevis, Behrokh, president and chief executive officer, Contour Crafting Corp., El Segundo, Calif. For innovations in manufacturing and construction, including the application of 3D printing methods.
Kiesler, Sara, program director, division of social and economic sciences, National Science Foundation, Alexandria, Va. For leadership, technical innovation, and identification of social trends with the adoption of computers and robots in toil and society.
Kircher, Charles A., principal, Kircher & Associates, Palo Alto, Calif. For advancing structural engineering exercise in earthquake engineering and loss prevention in edifice design.
Kiss, Robert, vice president, process and analytical development, Sutro Biopharma Inc., South San Francisco. For contributions to mammalian cell culture and microbial processes that defer recombinant proteins and antibodies.
Kogel, Jessica E., associate director for mining, National Institute for Occupational Safety and Health, Atlanta. For sustainable development and innovation of industrial clay products and processes.
Koon, John H., president, John H. Koon & Associates, Atlanta. For contributions to the design of systems to treat chemically tangled industrial wastewaters.
Kuehmann, Charles J., vice president of materials engineering, SpaceX and Tesla Motors, Palo Alto, Calif. For contributions to the creation and commercialization of computational materials design.
Kumar, Anil, associate fellow, specialty coatings and materials, PPG, Monroeville, Pa. For contributions in photochromism and variable polarization and leadership in commercialization.
Lam, Monica S., professor, computer science department, Stanford University, Stanford, Calif. For contributions to the design of advanced compiler and analysis systems for high-performance computers.
Lievense, Jefferson C., senior adviser to the chief executive officer, bioengineering and technology, Genomatica Inc., San Diego. For leadership in biomanufacturing of sustainable chemicals.
*Lorenz, Robert D., Elmer and Janet Kaiser Chair and Consolidated Papers Professor of Controls Engineering, department of mechanical engineering, University of Wisconsin, Madison. For contributions to modeling and control of cross-coupled electromechanical systems for high-performance electric machines and drives.
McCarthy, Kathryn A., vice president, research and development, Canadian Nuclear Laboratories, Chalk River, Ontario, Canada. For leadership in research and data analysis in uphold of licensing extensions for light water nuclear reactors.
McGill, Laura J., vice president, engineering, Raytheon Missile Systems, Tucson, Ariz. For technical leadership of missile systems for the United States and its allies.
McKinley, Gareth H., mechanical engineering department, School of Engineering Professor of Teaching Innovation, Massachusetts Institute of Technology, Cambridge. For contributions in rheology, understanding of tangled fluid dynamical instabilities, and interfacial engineering of super-repellent textured surfaces.
Moghaddam, Mahta, William M. Hogue Professorship in Electrical Engineering and professor of electrical engineering-electrophysics, University of Southern California, Los Angeles. For development of physics-based computational algorithms for mapping of subsurface characteristics.
Mokhtari, Sasan, president and chief executive officer, Open Access Technology International Inc., Minneapolis. For development of software for web-based electric power transmission access, including tagging and scheduling. Morel, Thomas A., president, Gamma Technologies Inc., Westmont, Ill. For development of computeraided engineering tools for engines and vehicles.
Morris, Robert T., professor, Computer Science and ersatz Intelligence Laboratory, Massachusetts Institute of Technology, Cambridge. For contributions to programmable network routers, wireless mesh networks, and networked computer systems.
Moyer, Mary Pat, founder, chief executive officer, and chief science officer, INCELL Corp. LLC, San Antonio. For entrepreneurship and development of cell lines, cell media, and testing technologies for regenerative medicine and biopharma products.
Nunes, Sharon L., retired vice president, smarter cities and distinguished green innovations, IBM Corp., Falmouth, Mass. For corporate leadership in development of next-generation green technologies, focusing on novel materials and processes.
O’Sullivan, Stephanie L., consultant and retired principal deputy director, U.S. Office of the Director of National Intelligence, Duck Key, Fla. For science, technology, and leadership in national security.
Picard, Rosalind, professor and director of affective computing research, Media Lab, Massachusetts Institute of Technology, Cambridge. For contributions to effective and wearable computing.
Pines, Darryll J., professor and dean, A. James Clark School of Engineering, University of Maryland, College Park. For inspirational leadership and contributions to engineering education excellence in the United States.
Prather, Kimberly A., Distinguished Chair in Atmospheric Chemistry, department of chemistry and biochemistry and Scripps Institution of Oceanography, University of California, San Diego, La Jolla, Calif. For technologies that transformed understanding of aerosols and their impacts on air quality, climate, and human health.
Reid, John, director, product technology and innovation, Moline Technology Innovation Center, John Deere, Moline, Ill. For innovation in automation technologies for agricultural systems.
Samuel, Clifford M., senior vice president, access operations and emerging markets, Gilead Sciences Inc., Foster City, Calif. For innovations in supply chain management and manufacturing technologies central to delivering medication in developing countries.
San Martin, A. Miguel, chief engineer, guidance, navigation, and control, Jet Propulsion Laboratory, Pasadena, Calif. For technical contributions and leadership in guidance, navigation, and control leading to successful Mars entry, descent, and landing.
Sarter, Nadine B., professor, industrial and operations engineering, University of Michigan, Ann Arbor. For innovation in the design and exhaust of tactile displays for improved safety in aviation, automobiles, and health care.
Schuh, Christopher A., department head and professor, materials science and engineering, Massachusetts Institute of Technology, Cambridge. For contributions to design science and application of nanocrystalline metals.
Scott, Robert A., vice president, technology transfer, surgical research and development, Alcon, Lake Forest, Calif. For contributions in ophthalmological biomaterials for intraocular lenses, glaucoma implants, and surgical equipment.
Seltzer, Margo I., Herchel Smith Professor of Computer Science, School of Engineering and Applied Science, Harvard University, Cambridge, Mass. For engineering contributions to databases, file systems, and operating systems.
Semiatin, Sheldon Lee, senior scientist, materials/processing science and research leader, Metals Processing Group, Air obligate Research Laboratory, Wright-Patterson Air obligate Base, Ohio. For contributions to thermomechanical processing of aerospace alloys and emerging intermetallic materials.
Shanahan, Patrick M., acting secretary, U.S. Department of Defense, Washington, D.C. For aerospace industry leadership in commercial aircraft, missile defense, and rotorcraft and for service to the Department of Defense.
Shoop, Barry L., dean and professor of electrical engineering, Albert Nerken School of Engineering, The Cooper Union, unique York City. For leadership in developing engineering systems solutions for national security and contributions to military engineering education.
Shyu, Heidi, president and chief executive officer, Heidi Shyu Inc., Arlington, Va. For development of innovative radar/electro-optics/infrared systems in uphold of the U.S. Army and Air Force.
Sigur, Wanda A., retired vice president and deputy general manager, civil space, Lockheed Martin Corp., Seabrook, Texas. For contributions to human spaceflight exploration systems.
Smith, Jane McKee, senior research scientist for hydrodynamic phenomena, Engineering Research and development Center, U.S. Army Corps of Engineers, Vicksburg, Miss. For leadership in coastal engineering research and development resulting in improved infrastructure resilience.
Speer, John G., John Henry Moore Distinguished Professor and director, Advanced Steel Processing and Products Research Center, Colorado School of Mines, Golden. For the conception, invention, and reduction to exercise of quenching and partitioning steel.
Stanney, Kay M., president and founder, Design Interactive Inc., Orlando, Fla. For contributions to human factors engineering through virtual reality technology and strategic leadership.
Stein, Robert M., consultant, Brookline, Mass. For contributions to electronic systems for national security applications.
Stephens, Daniel B., chairman of the board and principal hydrologist, Daniel B. Stephens & Associates Inc., Albuquerque, N.M. For innovations in vadose zone hydrologic exercise and theory.
Tabors, Richard, president, Tabors Caramanis Rudkevich, Boston. For development of technologies for real-time locational pricing of electricity for reduced electric transmission congestion.
Tarokh, Vahid, Rhodes Family Professor of Electrical and Computer Engineering, Duke University, Durham, N.C. For contributions to space-time coding and its applications to multi-antenna wireless communications.
Thapar, Hemant K., chairman and chief executive officer, OmniTier Inc., Milpitas, Calif. For contributions to theory and exercise of coding and signal processing for high-density magnetic recording.
Tom, Jean W., group director, process research and development, Bristol-Myers Squibb, unique Brunswick, N.J. For leadership in the process development of multiple commercialized drugs.
Tomlin, Claire J., Charles A. Desoer Chair and professor, electrical engineering and computer sciences, University of California, Berkeley. For contributions to design tools for safety-focused control of cyberphysical systems.
Trolier-McKinstry, Susan, professor of ceramic science and engineering, Pennsylvania condition University, University Park. For development of thin film multilayer ceramic capacitors and piezoelectric microelectromechanical systems.
Tsividis, Yannis, Edwin Howard Armstrong Professor of Electrical Engineering, Columbia University, unique York City. For contributions to analog and mixed-signal integrated circuit technology and engineering education.
Udren, Eric A., executive adviser, Quanta Technologies, Raleigh, N.C. For leadership in advancing protection technologies for electric power grids.
Vaidyanathan, P.P., Kiyo and Eiko Tomiyasu Professor of Electrical Engineering, California Institute of Technology, Pasadena. For contributions to digital filter bank theory and design.
Wang, Christine A., senior staff scientist, Laser Technology and Applications Group, MIT Lincoln Laboratory, Lexington, Mass. For contributions to epitaxial crystal growth of III-V compound semiconductors and design of organometallic vapor-phase epitaxy reactors.
Wu, Margaret M., retired senior scientific adviser, ExxonMobil Research and Engineering Co., Odenton, Md. For contributions to synthetic lubricants for improved energy efficiency and machine protection.
Elected posthumously unique odd Members Bétin, Pierre Claude, retired senior vice president, Safran S.A./SNECMA, Villenave d’Ornon, France. For leadership of Europe’s solid rocket propulsion industry and contributions to launch and missile systems.
Brignole, Esteban A., professor emeritus, chemical engineering, Universidad Nacional Sur/CONICET, Bahia Blanca, Argentina. For contributions to molecular design of solvents, modeling of high-pressure angle equilibria, and leadership in research and academic-industry collaborations.
Cates, Michael E., Lucasian Professor of Mathematics and Royal Society Research Professor, department of applied mathematics and abstract physics, University of Cambridge, Cambridge, United Kingdom. For research on the rheology, dynamics, and thermodynamics of tangled fluids, and for scientific leadership in the European Community.
de Geus, Aart J., chairman and co-chief executive officer, Synopsys Inc., Mountain View, Calif. For leadership and technical contributions to logic synthesis for integrated circuits.
Dordain, Jean-Jacques, consultant and former director general, European Space Agency, Paris. For contributions to tangled space systems and leadership of space exploration programs worldwide.
Dyson, James, chairman and founder, Dyson Technology Ltd., Malmesbury, Wiltshire, United Kingdom. For development of advanced technologies and innovative products and for contributions to design and engineering education.
Jonah, Samuel E., executive chairman, Jonah Capital, Accra, Ghana. For leadership and technical contributions in advancing the mineral industry in Africa.
Laporte, Gilbert, Canada Research Chair in Distribution Management and professor, department of conclusion sciences, HEC Montréal, Montréal, Canada. For domain-defining contributions to the theory and exercise of vehicle routing, facility location, and distribution management.
Mair, Robert, emeritus professor of civil engineering and director of research, University of Cambridge, Cambridge, United Kingdom. For contributions to underground construction and smart infrastructure and for leadership in government, engineering practice, research, and education.
Mazumdar-Shaw, Kiran, chairperson and managing director, Biocon Limited, Bangalore, India. For development of affordable biopharmaceuticals and the biotechnology industry in India.
Murray, Christopher B., Richard Perry University Professor of Chemistry and Materials Science Engineering, University of Pennsylvania, Philadelphia. For invention and development of solvothermal synthesis of monodisperse nanocrystal quantum dots for displays, photovoltaics, and memory.
Qu, Jiuhui, professor, Research heart for Eco-environmental Sciences, Chinese Academy of Sciences, Beijing. For development of water treatment technology and leadership in improving water trait in China.
Ramamoorty, Mylavarapu, former chancellor, K L University, Vijayawada, Nacharam, Hyderabad, India. For technical leadership of power engineering research, development, education, and establishing national laboratories in India.
Rudnick, Hugh, emeritus professor, electrical engineering, Pontificia Universidad Católica de Chile, Santiago, Chile. For leadership in South American electric power markets, resource and transmission planning, and standards. Sohrabpour, Saeed, professor, mechanical engineering, Sharif University of Technology, Tehran, Iran. For establishing Sharif University as an academic heart of Excellence and advancing engineering and science education in Iran.
Spaldin, Nicola A., professor for materials theory, ETH Zürich, Zürich. For abstract contributions to further the territory of multiferroics.
Stevens, Molly, professor of biomedical materials and regenerative medicine, Imperial College – London, South Kensington, United Kingdom. For contributions to materials-based approaches for tissue regeneration and biosensing.
Zheludev, Nikolay, head of nanophotonics and metamaterials, Optoelectronics Research Centre, University of Southampton, Southampton, United Kingdom. For leadership and technical contributions to optical metamaterials and nanophotonics.
SAN DIEGO, Sep. 22 /CSRwire/ - Union Bank's San Diego headquarters edifice located at 530 B Street has been awarded LEED® Gold certification from the Green edifice Certification Institute under the standards established by the U.S. Green edifice Council. Gold status was awarded to six buildings across the United States in the most recent certification and Union Bank's San Diego headquarters edifice is one of only two in California.
LEED, which stands for Leadership in Energy and Environmental Design, is the nation's preeminent program for the design, construction, and operation of high-performance green buildings. It provides independent, third-party verification that a edifice project meets the highest measures of green edifice and performance.
"We are proud to receive such a prestigious recognition as the LEED Gold certification," said Kathy Breed, vice president in Union Bank’s Environmental Stewardship Department. "This award recognizes their environmental contribution to the San Diego community and reflects their commitment to being a socially accountable organization."
LEED certification of the edifice was based on a number of green design and construction features and policy changes that positively impact the building, its occupants, and the broader community including:
The improvements to the facility were implemented by Union Bank's facilities management vendor, Jones Lang LaSalle, a financial and professional services solid specializing in true estate services and investment management.
"Sustainable operating policies, practices, and energy efficiency improvements that contributed to this certification too align with Union Bank’s corporate commitment to sustainability, and are an vital allotment of their mandate in managing the facilities," said Joy Cole, general Manager of Jones Lang LaSalle. "We note more and more evidence that sustainability in buildings not only reduces operating costs but too fosters enhanced employee well-being and job satisfaction."
About UnionBanCal Corporation & Union Bank, N.A.Headquartered in San Francisco, UnionBanCal Corporation is a financial holding company with assets of $84 billion at June 30, 2010. Its primary subsidiary, Union Bank, N.A., is a full-service commercial bank providing an array of financial services to individuals, petite businesses, middle-market companies, and major corporations. The bank operated 396 banking offices in California, Oregon, Washington and Texas as well as two international offices, on June 30, 2010. UnionBanCal Corporation is a wholly-owned subsidiary of The Bank of Tokyo-Mitsubishi UFJ, Ltd., which is a subsidiary of Mitsubishi UFJ financial Group, Inc. Union Bank is a proud member of the Mitsubishi UFJ financial Group (MUFG, NYSE:MTU), one of the world's largest financial organizations. Visit www.unionbank.com for more information.
About LEEDLEED is an internationally recognized green edifice certification system, providing third-party verification that a edifice or community was designed and built using strategies aimed at improving performance across every the metrics that matter most: energy savings, water efficiency, CO2 emissions reduction, improved indoor environmental quality, and stewardship of resources and sensitivity to their impacts.
Developed by the U.S. Green edifice Council (USGBC), LEED provides edifice owners and operators a concise framework for identifying and implementing practical and measurable green edifice design, construction, operations and maintenance solutions.
New customers and partners accelerate global reach and adoption of HP's commercial 3D printing solutions to reinvent manufacturing
PITTSBURGH, PA--(Marketwired - May 8, 2017) - HP Inc. (NYSE: HPQ)
Today at Rapid + TCT, the industry's largest 3D additive manufacturing conference, HP Inc. demonstrated the global momentum of its Jet Fusion 3D Printing solutions as it scales its industry to meet rising customer demand. This includes the official unveiling of the unique HP ally First 3D Printing Specialization program, a wide array of installations with manufacturing service bureaus and product design firms in key geographies, and more than a dozen unique HP 3D Printing Reference and sustain Centers across the U.S. and Europe.
HP too announced the addition of Henkel AG & Co. to its open ecosystem for 3D printing materials and applications. HP's Jet Fusion 3D Printing solution is a production-ready commercial 3D printing system that delivers superior1 trait physical parts up to 10 times2 faster and at half the cost3 of current 3D print systems.
"Building on their sustain of more than 500,000 Multi Jet Fusion-produced parts, they are now scaling their 3D printing industry to the next level. Today they are expanding their solutions availability through unique resellers and service bureau partners, opening unique experiential facilities for customers and partners, and widening their open 3D printing materials ecosystem," said Stephen Nigro, President of 3D Printing, HP Inc. "We are honored that industry-leading companies such as BMW, Jabil, Johnson & Johnson, Nike and dozens more are looking to the innovations and economics delivered by HP and their partners to back reinvent their businesses for the digital manufacturing revolution."
New HP 3D Printing Reseller Program To meet growing international customer demand, HP formally unveiled its unique global reseller program -- the HP ally First 3D Printing Specialization program -- with more than 30 hand-selected, trained and certified partners. Initially focused on North America and Europe, the program enables leading manufacturing solutions providers to rapidly deliver HP's 3D printing technologies to customers and scale up to meet their needs. Certified HP 3D printing reseller partners will bring best-in-class expertise and lore of HP's Multi Jet Fusion technology to customers deploying the solutions, as well as value added services such as the enablement of unique applications and industry-leading response time and service quality.
Partners interested in more information about joining HP's ally First 3D Printing Specialization program can connect with a local HP team member at https://partner.hp.com/.
Service Bureaus and Product Design Houses Showcase unique HP Jet Fusion-powered 3D Printing Offerings Service bureaus and product design firms are a hallmark of manufacturing innovation, adopting leading-edge technologies ahead of the industry and delivering breakthrough services to their own end-customers. Leaders such as like a sparkle Radius, Forecast3D, travel Proto, Materialise, ProtoCAM, Proto Labs, Shapeways, Sigma Design and 3D Prod are installing HP 3D printing systems and genesis to deliver production trait HP Jet Fusion 3D printed parts.
Building on these successful installations, HP is expanding deployments with leading manufacturing service bureaus and design engineering firms across North America and Europe to enable a unique class of on-demand, industrial-grade 3D production parts and services.
To connect with an HP Jet Fusion-enabled 3D printing service bureau near you visit www.hp.com/go/3Dcontactus
HP Opens unique 3D Printing Reference and sustain Centers HP, in collaboration with numerous partners, is opening more than a dozen 3D Printing Reference and sustain Centers across North America and Europe to enable companies to engage with HP's Jet Fusion 3D Printing solutions in production-level scenarios. Testing and qualification of unique 3D printing use-cases will be enabled in controlled environments, providing customers a simpler path to further from prototyping to complete scale 3D production.
These centers initially involve facilities in Allentown, PA; Alpharetta, GA; Carlsbad, CA; Corvallis, OR; Livonia, MI; Louisville, KY; Manchester, CT; Milpitas, CA; Palo Alto, CA; San Diego, CA; and Vancouver, WA in the United States; and Raon-l'Etape, France; Leonberg, Germany; Eindoven, The Netherlands; Barcelona, Spain; and Birmingham, United Kingdom.
For more information or to schedule a visit to an HP 3D Printing Reference and sustain heart tickle contact www.hp.com/go/3Dcontactus
Henkel Joins HP's Open Materials and Applications Platform Henkel joins HP's ecosystem of global materials leaders including Arkema, BASF, Evonik, and Lehmann & Voss, to uphold HP's Open Platform for 3D printing materials and applications. HP's unique open 3D printing platform model helps expand the availability of unique materials and address a broader set of applications, lower materials and development costs, drive precipitate and performance improvements, and create unique possibilities for allotment properties that address specific industry needs.
Henkel, a global supplier of high-performance adhesives used in captious applications such as medical device, electronic device, and transportation vehicle assembly, plans to toil with HP in its state-of-art Open Materials and Applications Lab in Corvallis, Oregon to expand its broad product range. Henkel is focusing development on providing novel powder materials for exhaust with HP Jet Fusion 3D printers.
"The partnership between HP and Henkel is backed by stalwart market leadership, a legacy of innovation, and an aligned commitment to additive manufacturing," said Michael Todd, Corporate Vice President and Global Head of Innovation and unique industry Development, Henkel Adhesive Technologies. "With their broad material portfolio and customer basis across diverse industries, Henkel is able to champion custom 3D solutions through various functional applications. This, combined with HP's vision for open materials innovation, enables us to develop materials and applications once thought impossible."
Learn more about becoming a certified HP Open Materials and Applications Platform partner.
HP at RAPID + TCT
About HP HP Inc. creates technology that makes life better for everyone, everywhere. Through their portfolio of printers, PCs, mobile devices, solutions and services, they engineer experiences that amaze. More information about HP Inc. is available at http://www.hp.com.
Forward-Looking Statements This tidings release contains forward-looking statements that involve risks, uncertainties and assumptions. If the risks or uncertainties ever materialize or the assumptions prove incorrect, the results of HP Inc. and its consolidated subsidiaries ("HP") may differ materially from those expressed or implied by such forward-looking statements and assumptions.
All statements other than statements of historical fact are statements that could be deemed forward-looking statements, including but not limited to any projections of net revenue, margins, expenses, effective tax rates, net earnings, net earnings per share, cash flows, capitalize design funding, deferred tax assets, share repurchases, currency exchange rates or other financial items; any projections of the amount, timing or impact of cost savings or restructuring and other charges; any statements of the plans, strategies and objectives of management for future operations, including the execution of restructuring plans and any resulting cost savings, revenue or profitability improvements; any statements concerning the expected development, performance, market share or competitive performance relating to products or services; any statements regarding current or future macroeconomic trends or events and the impact of those trends and events on HP and its financial performance; any statements regarding pending investigations, claims or disputes; any statements of expectation or belief; and any statements of assumptions underlying any of the foregoing.
Risks, uncertainties and assumptions involve the necessity to address the many challenges facing HP's businesses; the competitive pressures faced by HP's businesses; risks associated with executing HP's strategy; the impact of macroeconomic and geopolitical trends and events; the necessity to manage third-party suppliers and the distribution of HP's products and the delivery of HP's services effectively; the protection of HP's intellectual property assets, including intellectual property licensed from third parties; risks associated with HP's international operations; the development and transition of unique products and services and the enhancement of existing products and services to meet customer needs and respond to emerging technological trends; the execution and performance of contracts by HP and its suppliers, customers, clients and partners; the hiring and retention of key employees; integration and other risks associated with industry combination and investment transactions; the results of the restructuring plans, including estimates and assumptions related to the cost (including any workable disruption of HP's business) and the anticipated benefits of the restructuring plans; the resolution of pending investigations, claims and disputes; and other risks that are described in HP's Annual Report on configuration 10-K for the fiscal year ended October 31, 2015, HP's Quarterly Reports on configuration 10-Q for the fiscal quarters ended January 31, 2016, April 30, 2016 and July 31, 2016, and HP's other filings with the Securities and Exchange Commission. HP assumes no responsibility and does not intend to update these forward-looking statements. HP's Investor Relations website at http://www.hp.com/investor/home contains a significant amount of information about HP, including financial and other information for investors. HP encourages investors to visit its website from time to time, as information is updated and unique information is posted.
1 Based on dimensional accuracy of ±0.2 mm/0.008 inches, measured after sand blasting. note hp.com/go/3Dmaterials for more info on materials specifications. Based on the following mechanical properties: Tensile power at 50, Modulus Z 1900, Modulus XY 1900. ASTM standard tests with PA-12 material.
2 Based on internal testing and simulation, HP Jet Fusion 3D printing solution tolerable printing time is up to 10x faster than FDM & SLS printer solutions from $100,000 USD to $300,000 USD on market as of April 2016. Testing variables: allotment Quantity -1 complete bucket of parts from HP Jet Fusion 3D at 20% of packing density vs very number of parts on above-mentioned competitive devices; allotment size: 30g; Layer thickness: 0.1mm/0.004 inches. like a sparkle Cooling is enabled by HP Jet Fusion 3D Processing Station with like a sparkle Cooling, available in 2017. HP Jet Fusion 3D Processing Station with like a sparkle Cooling accelerates parts cooling time vs recommended manufacturer time of SLS printer solutions from $100,000 USD to $300,000 USD, as tested in April 2016. FDM not applicable.
3 Based on internal testing and public data, HP Jet Fusion 3D printing solution tolerable printing cost-per-part is half the cost of comparable FDM & SLS printer solutions from $100,000 USD to $300,000 USD on market as of April 2016. Cost analysis based on: standard solution configuration price, supplies price, and maintenance costs recommended by manufacturer. Cost criteria: printing 1-2 buckets per day/ 5 days per week over 1 year of 30 grams parts at 10% packing density using the powder reusability ratio recommended by manufacturer.
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