HP0-J39 exam Dumps Source : Designing and Implementation HP P4000(R) SAN Solutions
Test Code : HP0-J39
Test title : Designing and Implementation HP P4000(R) SAN Solutions
Vendor title : HP
: 145 real Questions
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Dr Mylene Lagarde COW three.02
This direction is attainable on the MSc in international health coverage, MSc in health policy, Planning and Financing, MSc in eccentric health policy and MSc in international fitness policy (health Economics). This direction is obtainable with authorization as an out of doors option to students on other programmes the site rules permit.
Randomized trials gain long been used in the scientific world to verify the efficacy of scientific treatments. recently, social scientists gain begun the usage of the equal strategy, the utilize of random stint to allocate supplies or set aside in obligate a coverage intervention in another way to separate companies, with a view to check the causal results of the policy of activity. The recognition of randomized opinions has grown above all, however no longer exclusively, amongst researchers and policymakers in low- and center-revenue settings.
Conducting a successful randomized evaluation comprises many inter-linked steps and a fine figuring out of a brace of statistical concepts. Randomized reviews also constantly require to design and organise the statistics collection of imperative and efficacious advice, which contains a number of vital steps to steer limpid of pitfalls. it's therefore standard to exist mindful these different steps to design and implement randomised reviews effectively, or to exist in a position to critically analyse them.
This direction proposes a hands-on and intuitive strategy to designing and conducting a randomised comparison. in the first half of the path, they can talk about factors for conducting randomised reviews; how to design the randomise test to exist certain it answers the question(s) of activity (together with considerations of statistical vigour and pattern measurement calculation); the way to rob keeping of threats to randomisation. in the second half of the course, they will dispute useful issues raised by simple information assortment, together with how to foremost measure outcomes of pastime; how to design first rate equipment and how to conduct and maneuver fieldwork.
Seminars might exist designed to motivate college students to critically engage with the themes and succeed the technical abilities taught. each seminar may exist intently aligned with the lecture content to give college students the possibility to succeed the recent potential. Case experiences might exist chosen from a number of cultural backgrounds, to permit the presentation of a diverse latitude of settings and issues.
15 hours of lectures and 15 hours of seminars within the LT.
A draft protocol. students will exist asked to publish a brief 1,500 notice draft protocol with the aid of week eight. whereas some aspects of their travail might also quiet exist travail in progress (e.g. the utilize of bullet features), college students should exist expected to write down up the primary half of their protocol in a more targeted approach. The outlines could exist graded and feedback given to students. This makes it practicable for college students to derive positive adventure of writing at MSc even at LSE, and they will additionally suffer in irony more in particular the expectations of the summative evaluation. students could exist able to utilize this feedback of their writing of the summative work.
analysis suggestion (a hundred%) within the LT.
The purpose of the research protocol (four,000 phrases max) can exist to plot the randomised evaluation of a particular fitness programme. college students might exist requested to select one programme from a proposed checklist. they'll even exist given the selection to select their own intervention (pending settlement by their seminar leader).
The Alpina B7 is not your balanced BMW 7 collection. It rolls off the equal line because the general 7, however Alpina re-engineers a pretty respectable chunk of it to create a car that's extra expensive, greater efficacious -- and greater expensive. And the 2020 Alpina B7, announced Monday, keeps that tradition alive because it enters its third generation of US earnings.
The 2020 Alpina B7 is the sixth era of the automaker's hopped-up flagship par excellence. at the heart of the depend is an Alpina-massaged 4.four-liter twin-faster V8. recent engine administration utility and a bunch of other recent components result in an output of 600 horsepower and 590 pound-toes of torque. Its eight-speed computerized has been beefed up to deal with the additional output, too.
despite being a barge, its efficiency figures are damned marvelous. it'll hit 60 miles per hour from a standstill in precisely 3.5 seconds, 0.1 seconds sooner than earlier than. Given ample asphalt, this tremendous sedan won't cease except it crests 205 mph, eleven mph more than the remaining generation. And with a dual-mode Alpina exhaust on faucet, it can also exist reserved or violent the entire manner there.
those wheels will never derive historical.Alpina
Sporty doesn't always imply uncomfortable, though. The Alpina B7 has balanced air suspension and rear-axle steering to preserve coping with taut devoid of making the ride utterly exasperating. It also packs BMW's street Preview equipment, which uses camera and navigation records to installation the suspension to deal with bumps and different street annoyances. The gadget can diminish the ride top with the aid of 0.6 inches at elevated speeds, or it will possibly rear the car 0.8 inches to enrich ground clearance.
The Alpina's trademark wheels are returned for 2020, measuring 20 inches in diameter, however 21-inchers are additionally available. in the back of these wheels are upgraded brakes, measuring 15.fifty five inches in the front and 15.67 inches within the rear. To additional differentiate itself from the typical 7 sequence, the B7 has a recent entrance bumper, a recent rear spoiler and a handful of paint colorations wonderful to the B7.
The interior is dressed to the nines. balanced gadget includes a Nappa leather interior, a leather-based instrument panel, ceramic touches on the controls and gentle-close doors. The steering wheel has blue and eco-friendly stitching, whereas the doorsills gain blue embedded lighting and a plaque mentioning its site in the production queue. Heck, even the gauge cluster has a different Alpina design. recent shields and insulation elements rate the interior even quieter than before.
Of course, the B7 is a pricey proposition. When it goes on sale in the third quarter of 2019, it'll command $142,695 including destination, a miles bellow from the 7 sequence' basis expense of $87,445.
2020 BMW 745e: try their first drive during this plug-in hybrid.
2019 BMW three sequence: hunting for some thing a bit smaller?
Microsoft showed off the first purchaser windows combined veracity head-set up displays (HMDs) from companions corresponding to Acer, Dell, HP, and Lenovo lower back in October 2017 at an adventure in San Francisco. The gadgets launched alongside the windows 10 Fall Creators replace, with prices dawn at $299. The HMDs came with diverse designs, but identical specifications corresponding to a 1440X1440 decision reveal, and framerates of 60fps for PCs with integrated pix and 90fps for programs with discrete images.
while not an abominable lot within the manner of a refresh to lots of these contraptions happened, Samsung launched its second-era HMD, the Odyssey+ in October 2018, with improvements to requirements and the design of the machine. quickly, a different recent headset could exist on the way, as HP is additionally readying it subsequent-technology HMD, as per the folks at RoadtoVR who acquired an exclusive preview of the unannounced windows combined reality headset, codenamed ‘Copper’.
The report states that HP is re-designing its HMD from the ground up, and from the appears of it, it does loom dote a tremendous update. The equipment now sports an Oculus Rift-like design with the head straps going during the facets and above the pinnacle, meeting at a round structure at the again. The equipment is additionally expected to near with a heathered fabric on the entrance the site the cameras for monitoring are located. The headset is declared to exist lighter, making it extra at ease to set aside on, and it'll additionally characteristic greater mechanicals to rate it simpler to placed on and remove.
As for specs, the subsequent-technology equipment will present a 2160X2160 decision parade per eye, making it essentially the most pixel-dense parade in a blended veracity Headset yet. In evaluation, Samsung’s recent Odyssey+ activities a 1440X1600 decision expose per eye. definitely, the denser screen makes for crisp, limpid images, bringing a remarkable deal-obligatory advancements to the adventure. The denser expose also helps mask the parade door repercussion (the repercussion brought about via the unlit areas between any two pixels), negating the want for further components just dote the diffuser on Samsung’s Odyssey+.
HP states that the improvements to the HMD got here from its enterprise purchasers and that the purchasers didn’t believe the box of view a large enviornment of issue as a respectable deal as the resolution and comfort. The company is planning on bringing this headset to its gadget as a service for VR providing as a piece of the Z with the aid of HP company.
whereas HP did not exhibit details in regards to the launch date or pricing, the enterprise did verify that it should exist promoting the device to each, agencies and patrons. home windows combined veracity has been receiving advancements within the latest check builds for the next primary windows 10 replace, which may basically definitely exist called the home windows 10 April 2019 update. The platform has also begun seeing expanded relevance in gaming, so it can exist entertaining to study how well ‘Copper’ will exist acquired, and if the advancements hearten extra users to believe it.
supply: RoadtoVR by means of Thurrott
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Thursday 25 February Wednesday 24 February Tuesday 23 February Monday 22 FebruaryThe Photo Gallery highlights technical events, the Exhibition, and more.
The Mock ordeal Photo Gallery provides coverage of judges, wigs, and much more.
Thursday 25 February 2010
It’s back: Energy returns to lithographyIt was limpid throughout SPIE Advanced Lithography that energy has returned to the lithography sector, agreed Symposium Chairs Christopher Progler and Donis Flagello. They praised the outstanding travail on the piece of conference chairs in organizing the programs, and the high-quality of content presented by the authors.
The week was characterized by replete conference rooms, sedulous exhibit aisles, and networking that started over breakfast and continued long past dusk. Technical conference attendance was another indicator, coming in nearly one-third higher than last year. The final count for total attendance for 2010 was 2,100.
Standing-room-only conference rooms and high-energy networking continued through the final day, with the last sessions in five conferences, professional development courses, and award announcements topping off the week.
Andrew Estroff,Rochester Institute of Technology, was given the Cymer-sponsored Best Student Paper in Optical Metrology Award for his paper on “Metamaterials for enhancement of DUV lithography.” Marshall Miller, Univ. California, Berkeley, won Honorary Mention for his paper on “Automatic numerical determination of lateral influence functions for rapidly CAD.”
Technical special events concluded with a panel discussion on reference metrology in the nanotechnology process. The panel was moderated by Vladmir Ukraintsev, and included six panelists from Asia, Europe, and North America representing industry, academia, research, and manufacturing perspectives. Held in the Metrology, Inspection, and Process Control conference, the panel was also a piece of the Global Collaboration in Reference Metrology working group meeting.
Wednesday 24 February 2010
Full rooms, sedulous aislesAll six conferences were in session on Wednesday, with many papers drawing packed audiences. Technical attendance is up more than 25% at this year’s SPIE Advanced Lithography, reflecting an optimistic trend throughout the industry.
Technical special events included a panel sponsored by NIST on “Strategies for increasing the value of metrology and inspection,” and a well-attended poster session for conferences on EUV, Alternative Technologies, Optical Microlithography, and Design for Manufacturability through DPI. Moderators for the NIST panel were George Orji and Ronald Dixson.
On Day Two in the exhibition hall, the aisles were replete of shoppers and customers,and exhibitors reported much deal making on the floor as well as at the numerous company events. “Based on AL and other indicators, 2010 looks better,” said Sara Eideh of Synopsys. “We are delighted with how respectable Advanced Lithography 2010 has been.” Eideh said turnout for her company was nearly 50% better than last year.
Tuesday 23 February 2010
Panel Discussions Address Nano and EUVSPIE Advanced Lithography continues to exist the site to find the perquisite people, according to Day One feedback from exhibitors, with the equable traffic and tough energy on the exhibit floor providing more positive indicators of economic health. In the words of Wilma Koolen-Hermken, CEO of HamaTech,“It is obvious by the success of the meeting that the industry has begun to turn around."
Others were enthusiastic as well. "Advanced Lithography is awesome, as always," said Ron Synowicki of J.A. Woollam, who was already pleased with the leads he had gotten only four hours into the show. "Nothing is better than face-to-face interaction with customers. We're seeing a remarkable coalesce of academia and industry."
“We were delighted that the attendees came in for afternoon coffee and stayed to talk business," said Patti Shaw of Brewer Science. "Leads are up over last year and the attribute is good." Shaw said that Brewer doubled the number of staff they brought to Advanced Lithography this year, another indicator that business is on a up-swing.
Conference rooms were sedulous throughout the day and at times standing-room-only, and a panel on metrology in the current economy closed the day for the Metrology, Inpsection, and Process Control conference.
A Women in Optics luncheon presentation featured a talk by Anna Sidana of One Million Lights, an initiative to improve education, personal income, health, and environmental attribute in developing countries by replacing kerosene lamps with portable solar lighting.
It was a sedulous evening as well, with approximately 1,000 attendees at the first of the week's two poster sessions, and a spirited "trial" pitting EUV against DPT.
Mock ordeal Examines compete TechnologiesOnly at SPIE Advanced Lithography in San Jose will you witness the world's top minds in the semiconductor industry donning black robes and white wigs and participating in a mock ordeal (heavy on the "mock") to determine the feasibility of compete technologies for the 22-nm HP node and beyond.
Like a scene from Inherit the Wind or To assassinate a Mockingbirdseen through psychedelic lenses, an overflowing courtroom brimming with standing observers rose to homage Judges Chris Progler of Photronics and Donis Flagello of Nikon as they entered the court. Representing EUVL were Obert Wood and Bruno La Fontaine of Global Foundries, and representing double patterning ArF were Will Conley of Freescale and Mircea Dusa of ASML.
The judges encouraged the audience, who were serving as jury, to plod to the side of the leeway they agreed with as the ordeal progressed. This would prove difficult, as every bit of seats and every bit of standing leeway was well occupied with rapt observers. arbiter Flagello reiterated that this court observed no legal code other than Moore's Law, and as evidence of this, the jury was asked to stand and bow allegiance to a massive, projected image of Gordon Moore.
Opening arguments began with the case for EUVL, argued by Wood, who asserted that "it's every bit of about k1." Comparing EUV vs DPL 193i, he showed significant degradation in DPL vs EUVL at 40-nm HP, and claimed that 22-nm HP was simply not practicable with double patterning, while Zeiss had optical designs already to extend EUVL to below 22 nm.
Conley went on the beset in his opening arguments for double patterning, showing roadmaps of ArF pitch division vs EUV.
As a first witness, Skip Miller of ASML presented his cost analysis for patterning options at 2x-nm HP, showing that single-exposure EUV displayed the lowest cost of every bit of options.
Tatsuhiko Higashiki of Toshiba showed the Toshiba roadmap for EUVL to extend the spacer process, declaring that a 2x-nm HP node process study will start this year or next to address some primary challenge, such as defectively < 0.1/cm2 and throughput above 100 wph.Janice Golda then showed Intel's needs to ramp up manufacturing at the 22-nm node by 2015. For logic layouts, she said, one might exigency 4 or more masks. She also asserted that a microprocessor company dote Intel is much more sensitive to mask defectively than a recollection maker, so Intel was challenged to rate a zero-defect EUV reticle, which they did accomplish recently.
Paul Ackmann from Global Foundries pointed out that the biggest issue is getting a recent technology in site as soon as possible, and EUV has an advantage in that it can backfill to earlier technologies , while DPL cannot.
Nigel Ferrar of Cymer was asked whether EUVL could exist powered without a nuclear power plant, a reference to char Lin's oft-quoted assertion that EUVL sources will gain exorbitant power needs. Ferrar stated that needs will exist ~3x what an ArF scanner requires today, and that a 350 W source that delivers 150 wph will exist available in 2011.
An energetic Conley then cross-examined the EUV team's witnesses on source power with a comedic design of EUVL powered by the Hoover Dam, and plotted his estimation of EUV fab and instrument costs vs the GDPs of countries dote Tonga, Belize, and Latvia.
The witnesses for DPL then took the stand, dawn with Kevin Lucas of Synopsis, who showed multiple design rule and patterning options to extend into 22 nm and below.Kit Ausschnitt of IBM quoted Hamlet and displayed a very vivid animation of the "overlay elephant" that must exist confronted to plod to smaller nodes. He stated that overlay improvements will enable 193 nm DPL extension to 22 nm and beyond, but there will exist no dearth of overlay challenges in either case. Certainly, he said, EUV is inevitable, but so is the imminent collapse of their sun. Possibly, he jabbed, EUVL will exist ready by then.
Andrew Hazelton of Nikon then pointed to Nikon's S620D shown in the Plenaries to exhibit that DP is available today, and Patrick Wong of IMEC showed that for the 22 nm node, various solutions exhibit swear for different layers and applications.
Wood's Perry-Masonesque cross-examination of the DPL witnesses focused on the cost issues and complexity of the many masks necessary. The DPL witnesses rebutted his math and stood their ground that overlay was not a problem for DPL.
After closing arguments, arbiter Progler noted that the sheer number of observers serving as jurists made affecting to their favored side of the leeway impossible, so he called for applause to determine the trial's winner. With equal applause, Progler declared a hung jury and adjourned, hinting that a retrial will exist needed next year.
Many more photos are available in the Mock ordeal Photo Gallery.
Monday 22 February 2010
Panel Discussions Address Nano and EUV
Nanotechnology in Microlithography Panel Discussion: Self-Assembling Molecules for Semiconductor Patterning and Nanoelectronics
Panel Moderators: Richard M. Silver, National Institute of Standards and Technology (United States) and Christopher L. Soles, NIST (United States)
The evening panel discussion on nanotechnology in microlithography opened with comments by moderator Christopher Soles of NIST, who set the tone by contrasting "bottom-up" processes dote self-assembly (SA) with traditional "top-down" lithographic processes. Between these technologies, Soles explained, they gain major differences - natural shapes vs conventional circuit design, local vs long-range order, monolayers vs elevated aspect ratio features, CMOS vs emerging applications, intrinsic scaling limits vs nanoscale dimensions, wet, soft processes vs immaculate leeway processes, tedious ordering vs 100 wph, and the current pretty research pictures of SA vs loyal functional devices using lithography. He invited the panelists to dispute the near- and long-term prospects of SA and dispute the materials and metrology needs.
Dan Herr of SRC then presented some of the challenges of directed self-assembly, including the needed shapes, throughput, and defects. He asserted that SA could very well exist an augmenting technology to current processes rather than a competing technology.
Greg Waldraff of IBM followed by presenting examples of electronic component self assembly on templated DNA biogrids, describing the competence of DNA origami to create nanoscale devices.
Lars Liebman, also of IBM, made a case for dawn research now at the NSF even so that the technology is age by 2016-2017, the time period Herr had predicted SA could exist introduced into manufacturing. However, he cautioned that the community needs to exist certain it is tackling the perquisite problem and not ignoring trimming or other issues.
Joy Cheng of IBM joined her colleague, Dan Herr, in displaying recent travail in polymer self assembly, and Katy Bosworth predicted that the travail they are doing at Hitachi on difficult drive media could exist one of the first to insert block copolymers into a lithographic process.
Robert Brainard of Albany CNSE concluded the presentations by showing the relationship between chemically amplified resists, nanoimprint, and self assembly, asserting that each technology has remarkable strengths but will not exist replacing each other. The panel then opened for debate and questions from the audience.BACUS Technical Group Panel Discussion: EUV Source $10M. EUV Scanner $100M. Defect Free EUV Photomask, Priceless! For some there's NIL, for everyone else, there's EUV.
Panel Moderators: Bryan S. Kasprowicz, Photronics, Inc.; Franklin D. Kalk, Toppan Photomasks, Inc. Panel members (from left): Gilroy Vandentop, Bryan Rice, Anthony Yen, Oliver Kienzle, Tatsuhiko Higashiki, Paul Ackmann, Ben Eynon.
Advanced Lithography opens to optimism, overflowing house
A standing-room-only audience for the opening plenary session at SPIE Advanced Lithography in San Jose served as one more symptom that the lithography industry is in a growth mode. Before the speakers from Nikon, Intel, and the venture capital solid Silver Lake Partners took the stage, a prestigious optical microlithography award and five recent Fellows of SPIE were announced.
M. David Levenson, now associated with BetaSights, was named this year’s winner of the Frits Zernike Award for Advances in Optical Microlithography, for his travail in developing facet shifting masks. The Frits Zernike Award is sponsored by Cymer and ASML.
The five recent Fellows from the lithography community -- Robert Allen, Jon Benschop, Clifford Henderson, Soichi Owa, and James Potzick -- are among a total of 62 recent Fellows of SPIE elected this year. The recent Fellows were honored with 20 other lithography Fellows at a luncheon later in the day.
More awards followed the talks, including:
C. award Willson Best Paper award for 2009, to Richard Lawson, Laren Tolbert, and Clifford Henderson of Georgia Tech and Todd Younkin of Intel Corp.
Jeffrey Byers Award for Best Poster Paper in Resist Materials and Processing Technology for 2009, to Xinyu Gu, Adam Berro, Younjin Cho, Kane Jen, Saul Lee, Tomoki Ngai, Toshiyuki Ogata, William Durand, and award Willson of Univ. of Texas at Austin, Arunkumar Sundaresan, Jeffrey Lancaster, Steffen Jockusch, and Nicholas Turro of Columbia Univ., and Paul Zimmerman of Intel Corp.
The Willson award is sponsored by AZ Electronic Materials and Rohm Haas Electronic Materials, and the Byers award is sponsored by Tokyo Electron.
Three conferences opened sessions Monday morning, and two of several panel discussions scheduled for the week closed the day. Richard Silver and Christopher Soles of NIST moderated a panel on Self-Assembling Molecules for Semiconductor Pattering and Nanoelectronics. Bryan Kasprowicz of Photronics Inc. and Franklin Kalk of Toppan Photomasks moderated the BACUS panel on future potential technologies, including EUV, NIL, double patterning and direct wire.
Plenaries Explore Past and Future of Lithographic TechnologiesThe plenary session for the 35th year of this symposium got underway with three presentations exploring the past successes and future prospects of lithographic technologies.
Kazuo Ushida of Nikon presented his predictions for lithography's future, promising not to bring rotten news, because as the Japanese proverb goes, "The priest who preaches foul dogma shall exist reborn as a fungus." He predicted that although the next few years study respectable for fab equipment, it's very unlikely that this industry will revert to its former levels. Current thought, said Ushida, is that double patterning will rob lithography from the 32 to the 22-nm node, and EUV will rob it from the 22 to the 16 nm node. However - what, he asked, if EUV comes too late?While the prospects of EUV are remarkable for advancing to the 22-nm node, Ushida declared that EUV quiet has a long way to fade because 100x improvement is required in mask defectivity to achieve such feature reduction. Should development of the necessary mask infrastructure start today, he predicted, it would rob 2 years for tools to exist available and another 2 years to fully understand defects before EUV could exist a reality in 2014 - long after it would exist needed for the 22-nm node. Because of this, one needs to study at alternative means of achieving the 22-nm node.
He presented three alternatives: spacer double patterning, pitch splitting double patterning, and line-cutting lithography, the last of which enables ArF extension to 16 nm. Because EUV is too far off to exist practical, he said that 22 nm requires double patterning with immersion, which in turn will require elevated overlay accuracy, CD uniformity, excellent throughput, low cost of ownership, rapidly installation, and the possibility of reuse for next generations. He then presented Nikon's solution to every bit of of these issues - the NSR-S620D - which has less than 2 nm overlay and 200 wph throughput and allows a modular approach to its construction enabling multigenerational use. Although 2010 and 2011 will exist respectable years as the industry recovers, Ushida asserted that EUV challenges in mask infrastructure will delay its implementation until the 16-nm node.
Eric Chen of Silver Lake Partners then gave an overview of the economics behind the lithography industry and voiced his concerns that without a change in global balances, the economy will never fully recover. However, he suggested that with a change in paradigms, there is remarkable market potential. The root causes, he said, of the worst global economic conditions in recorded economic history (the 2009 recession) were the ease of liquidity, the US real estate market bubble, and the widespread excess leverage.These created a pass that is just now seemingly stabilizing, but they aren't out of the woods yet. The last 20 years has seen an unprecedented integration of global economies that gain resulted in an imbalance in the world economy. Chen asserted that this model is broken, and without normalized growth in developing economies as well as the driving down of debt and consumption in developed countries, the economy will not rebalance.
Chen reminded the audience that a recession in the tech sector was seen most recently in 2000-2001 when the equity bubble burst (as opposed to 2009's debt bubble). Unfortunately, debt bubbles are more strict and harder to recoup from. Two things drive economic growth - demographic changes and changes in productivity. Since productivity increases are driven by technology, Chen said, technology advances will likely save the day and drive recent growth.
Chen then reviewed a number of macro trends in technology. First off, he described the evolution of software into a service economy, such as the change from CDs and personal programs to iPhone apps and cloud computing driving mobile and telecom. He pointed out the increasing pace and scale of immaculate technology, and then summarized the growing threat of Asia, noting its tower as an innovation leader as it moves from the inexpensive commercialization of technology to encompassing low-cost R & D on the leading finish as well.
Sam Sivakumar of Intel then presented a talk that looked at the evolution of lithography as a play in four acts, starring the triumvirate of lithography, design, and process architecture.
In Act I: The far-off Past, Sivakumar considered the .25 micron and earlier technology and organize that during that time period, lithography delivered design intent, but did not influence design or architecture. In Act II: The Recent Past (down to 65 nm), lithography then delivered design intent with some difficulty, such as in rule-based serif placement and hotspot determination. In present time, Act III (45-32 nm), lithography is now interacting closely with design and process architecture, profoundly influencing methodology in both areas.
As for the future, he predicted (1) lithography will play a central role in defining design methodology and process architecture; (2) mask technology has become and will continue to exist an integral piece of lithography planning for the next generation; and (3) managing the cost of patterning will exist the real challenge in the near term. But lithography has become a full, equal confederate with design and process integration and the attribute of their interaction will determine the industry's success or failure.
Beautiful Barcelona houses a charming intersection of gothic architecture, twentieth century art, and burgeoning twenty-first century technology. Serving as the site of last week’s insightful HP Global Innovation Summit, the city welcomed journalists and analysts from around the world to participate in two days of insights into the heart of disruptive technologies. 3D printing and immersive computing picture keys to the future of disruption — and to Industry 4.0. Never content to fade along for the journey, global mainstay HP Inc. is working to secure a driver’s seat to this future, focusing on reinventing for this onward momentum.
While the first day of the acme focused on HP and its approaches and offerings, the second day featured customer and confederate stories highlighting real-world implementation of 3D printing and immersive computing technologies. With rising global installations of Multi Jet Fusion (MJF) 3D printing technology, partners including the newly-opened International Advanced Manufacturing 3DHUB (IAM 3DHUB) serve as viable examples of additive manufacturing in utilize today. During the summit, reports from France-based Sculpteo, Barcelona-based FICEP S3, and Belgium-based ZiggZagg provided further first-hand experiences bringing MJF to the everyday of industry.
A 3D printing panel opened the morning, as Vice President and general Manager of Multi Jet Fusion Ramon Pastor moderated a session including Sculpteo CEO and Co-Founder Clément Moreau, FICEP S3 Director Nuno Neves, and ZiggZagg CEO Stijn Paridaens.
“We started with 3D printing out of necessity, to design recent machinery, innovative machinery; they had a lot of troubles getting optimal geometries by machining, so they adopted 3D printing,” Neves explained of his company’s approach to incorporating additive manufacturing. “Now they sequel R&D in additive manufacturing for other companies, helping other companies derive to where they are now. We’ve been here eight years, and doing 3D printing for a year and a half — it was HP who introduced us to 3D printing.”
ZiggZagg has been on the market now for about seven years, and started working with HP’s 3D printers about a year ago. The company went from one machine to six machines over the last twelve months, and Paridaens noted that they remark “a lot more to come; they remark a huge market opening up with this technology.”
Sculpteo, which started with 3D printing for rapid prototyping, now incorporates the technology throughout its operations alongside other manufacturing technologies and uses 3D printing for mass production.
“We are a manufacturing center, not that much a design center; their customers sequel pretty much everything,” Moreau noted, showing a 3D printed helmet Sculpteo created using HP’s technology. “Multi Jet Fusion for this nature of product is definitely the only respectable possibility that you have. This is a recent nature of product, a recent nature of geometry — you cannot rate this by injection molding.”
Geometries, strength, and charge points were the major factors that each of the three kept returning to, as Neves noted that making one of their Da Vinci Paint Machines using MJF eliminates about 2,000 molds and that, effectively, the company’s investment into the industrial 3D printer was reutrned through the course of making just one machine.
“I correspond that charge is one of the reasons to adopt MJF,” Paridaens said. “We are planning to purchase an additional five printers by the finish of the year… They add some sort of a value to a piece that helps the customer that can only exist produced by 3D printing… Really making now the strategy of mass customization and mass production, they remark a large market opening up… As of now, I believe customers are quiet not ready if you fade perquisite toward them, but if you gain large concerns, large companies” employing the technology, adoption becomes more likely. “Also recent materials coming up are one of the key factors why they decided to adopt this technology.”
Trust, Pastor underscored, is “key to adoption” for recent technologies. In many sectors, such as engineering, potential adopters are often risk-averse and prefer to wait to tried-and-true techniques in which they trained — even if that training was decades ago. Learning the intricacies of a recent approach requires significant dedication, as, for example, design for additive manufacture (DfAM) represents a wholly recent approach separate from traditional design for machining or other subtractive technologies. Dedicating time, floorspace, and other resources to a recent suite of technologies requires confidence that the process will exist worth it. Pastor asked the gathered executives about their thoughts on the key factors to unlock the market and accelerate adoption.
“Company engineers are the key factor, they are the ones making the designs,” Paridaens said. “We remark in Belgium that education is now keeping up, kids in college are introduced to the technology. When they fade to the customer, they say, ‘We gain done it this way for decades, let’s sequel it this way.’ It’s a matter of trust. It needs to exist proven.”
Building on that response, Neves added, “People maintain designing parts the way they’ve always done it… With MJF, what’s hardest is getting people to actually come, to remark the product, feel it with their hands. They finish up giving away a lot of samples… The key word is implementation… If you maintain doing things the way you’ve been doing them, if you design as you’ve been designing, you won’t design anything new.”
Neves noted as well that truly understanding the technology and its capabilities allows for informed design that enables the perquisite design the first time. While 3D printing famously speeds iteration and prototyping processes, understanding the control of dimensional precision — as well as how a piece will cool, and so contract or expand — allows for a speedier time to market for final parts production. DfAM requires significant attention and energy, but once through the learning curve, proves itself with a rapidly ROI and ensuing profit, Neves added later when they sat down for a lengthier conversation.
During the panel, Pastor asked Moreau, Neves, and Paridaens to “open your crystal balls for a study into how you remark the future” and what challenges 3D technologies will gain in unveiling this future.
“3D printing, or additive manufacturing, really becomes a manufacturing technology for everyone,” Moreau began.
“One key thing, they learn that education is key, design is key, software is also very considerable — the way you organize a factory software-wise is very important. An additive manufacturing factory is not just a factory with additive manufacturing; it’s something you exigency to wield very carefully. You cannot organize a short-run production factory in exactly the identical way you would organize a mass production factory. recent software tools exigency to exist involved and imlemented. In this way, I contemplate they can gain additive manufacturing factories everywhere, in service bureaus as well as in customer hands.”
Sculpteo, for its part, certainly understands the wide gain of 3D printing, as its global operations are up and running to serve a broad variety of customers with a variety of manufacturing technologies. Late last year, the company introduced its Fabpilot software, designed first for internal utilize to connect operations at its Paris and San Francisco facilities, and broadened for customer utilize to smooth workflows for 3D printing for production.
Neves underscored the jiffy of software, building on Moreau’s point. More accurate simulation is a specific exigency for the future of additive manufacturing, as current solutions “don’t always hold up.” As an example, he pointed to a piece from FICEP that breaks at a 20 kilogram load; “SOLIDWORKS says it should shatter at 16 kg; on the one side this is good, it’s stronger than they think; on the other hand, they utilize more material than they exigency to because of this.” Understanding the exact load capabilities is necessary for designing for the requisite power of a given part, including the amount of material. Simulation is certainly in focus for many software companies in the 3D space, and Neves’ crystal ball reading on this front aligns well here.
Looking more deeply into his crystal ball, Neves noted embedded electronics as a next tremendous thing for 3D printing. This development is held back not only by today’s additive manufacturing capabilities, but by industry standardization in the shape of a common connector for sensors.
“This will exist a lot of work, and everyone has to travail together,” he noted. “HP has to travail with its customers to basically evangelize this industry. Once they rate parts for a customer, they are a iterate customer. This is quite nice. It’s getting this person, this company, to rob the responsibility, the ‘Yeah, I want to try this.'”
Speaking as well to the future in a mp;A with the gathered attendees, Moreau added that another trend Sculpteo is seeing comes in the shape of requested materials. flexible and food- and skin-contact safe materials are at the top of the request list. FICEP and ZiggZagg sequel most of their 3D printing travail in HP’s available materials, with PA 12 predominant for both at present. Future materials offerings hold remarkable interest to both of these companies, but PA 12 is expected to remain a mainstay even as additional, particularly more flexible, materials emerge.
“What else I would dote to remark is metal, but that’s a different machine,” Neves said — and indeed, HP has announced its intent to present a metal 3D printing system.
An challenging and considerable issue that Paridaens raised as well was in response to a question in which it was suggested that additive manufacturing may rob the site of traditional techniques.
“It’s comical how you utilize the word ‘replace.’ I don’t contemplate additive manufacturing will supersede traditional manufacturing — it will add to traditional manufacturing,” he said. “It’s not the holy grail. It’s something that can succor in a prototyping stage up to the production stage.”
3D printing is, indeed, a manufacturing technology, not a magical retort (or, going back to the days of elevated hype, a Replicator from the Enterprise). Recognizing the complementary nature of these technologies for industry is a key piece of the adoption and education process, and Paridaens’ underscoring this messaging in a discussion of real-world applications was a well-placed reminder that disruption doesn’t necessarily denote full-on displacement.
Following this panel discussion, immersive computing took center stage with insights in real-world applications for personalized footwear.
I also sat down for longer conversations with Paridaens and Neves later, including a visit to FICEP’s facility outside Barcelona, for additional insights into their implementation of 3D printing into their workflow and strategic approaches — wait tuned for these interviews and more from my whirlwind time in Barcelona.
Discuss HP, Multi Jet Fusion, the future of manufacturing, and other 3D printing topics at 3DPrintBoard.com or participate your thoughts in the Facebook comments below.[All photos: Sarah Goehrke]
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